825502B02853 Allicdata Electronics
Allicdata Part #:

CR480-ND

Manufacturer Part#:

825502B02853

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 25.4X12.7X30MM
More Detail: Heat Sink TO-220 Aluminum 1.0W @ 20°C Board Level,...
DataSheet: 825502B02853 datasheet825502B02853 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Shape: Rectangular, Fins
Length: 1.180" (29.97mm)
Width: 0.997" (25.33mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal - Heat Sinks are an important part of electronics engineering, as they play an essential role in helping transfer heat away from components which generate it. The 825502B02853 Heat Sink is a particularly useful example of such a product. It features an optimized profile, higher performance and lower thermal resistance compared to other, similarly sized heatsinks. In addition to this, it has been designed to work with a wide range of electrical components, ensuring it can be deployed across multiple applications.

Application Field of 825502B02853 Heat Sink

The 825502B02853 Heat Sink has been designed with a wide variety of applications in mind, ranging from small embedded applications to those in larger equipment such as industrial control systems. Its effectiveness in cooling components is universally recognised, meaning it can be employed with confidence in a variety of situations. It can also be used with components which generate higher amounts of heat, including CPUs and ASIC chips.

Working Principle of 825502B02853 Heat Sink

The primary working principle of the 825502B02853 Heat Sink is the transfer of heat energy. The device is designed using high-efficiency aluminum fins, which act to increase the surface area of the heatsink. This provides more area with which to transfer the heat energy generated by the component(s) to the surrounding air, allowing the device to remain cool and operational. Secondly, the device uses air flow around and through the aluminum fins to further increase the heat transfer. This helps to further ensure that the temperature of the component remains low.

Conclusion

The 825502B02853 Heat Sink is a high-performance, efficient and effective solution for aiding in the transfer of heat away from components. It has been designed to be widely compatible with a variety of electrical components, meaning it can be used to great effect in both embedded and larger applications. Furthermore, its optimized profile helps to further ensure it can keep components running at a lower temperature. This is achieved by two main working principles, both of which work together to ensure the heatsink maintains its effectiveness.

The specific data is subject to PDF, and the above content is for reference

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