8256BPT00000

Series:	--
Part Status:	Obsolete
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	1.180" (29.97mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	1.0W @ 20°C
Thermal Resistance @ Forced Air Flow:	6.00°C/W @ 300 LFM
Thermal Resistance @ Natural:	--
Material:	Copper
Material Finish:	Black Paint

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Thermal - Heat Sinks are essential for dissipating heat away from vital electronics, such as processors. In some cases, the need for a reliable cooling solution can be fulfilled simply by proper airflow, while other applications require a more robust solution like a heatsink. 8256BPT00000 is just such a product, designed to provide highly efficient heat dissipation for the most demanding applications.The 8256BPT00000 was designed for use in harsh environments. It features an innovative, patented design that provides superior thermal performance, with an extremely low profile. The 8256BPT00000 heat sink is manufactured from die-cast aluminum, which ensures superior heat dissipation from temperatures as low as -10°C. The size of the 8256BPT00000 heat sink is 50mm x 58mm x 19mm with a weight of only 400g.The 8256BPT00000 addresses two key issues with heat dissipation, namely the surface area and the thermal conductivity of the material used in the construction of the heat sink. A high surface-to-volume ratio, in combination with the excellent thermal conductivity of aluminum, ensures efficient and rapid heat dissipation.The 8256BPT00000 is designed to be used as a component or part of an existing system. It may be placed passively or actively cooled and can be combined with other types of components, such as fans or active heat exchangers, to increase cooling efficacy.The effective heat dissipation of the 8256BPT00000 is due to the presence of up to 64micro aluminum fins, which significantly enhance the surface area available for air circulation. The die-cast aluminum ensures excellent thermal conductivity, while the fins act as micro-channels for efficient heat dissipation. The aluminum fins also allow heat to be removed from even the smallest of electronics, such as micro chips and circuit boards.The 8256BPT00000 is designed to operate efficiently with both active and passive cooling solutions. When paired with a fan or liquid cooling system, its superior cooling performance is further enhanced. It is also designed to provide low acoustic performance, making it ideal for applications where a quiet solution is desired.When used in combination with other components, the 8256BPT00000 can provide up to 90% heat dissipation efficiency, with temperatures ranging from -10°C to 120°C. This means that systems that are dependent on reliable cooling solutions can be operated in a variety of temperatures and environments with peace of mind.Overall, the 8256BPT00000 provides an efficient and reliable heat dissipation solution for the most demanding cooling applications. Its innovative design ensures superior performance, reliability and low noise levels. Combined with other components, it offers a high degree of thermal protection and long-term performance.

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