826002B05300 Allicdata Electronics
Allicdata Part #:

CR503-ND

Manufacturer Part#:

826002B05300

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 9.7X44.5X36.8MM
More Detail: Heat Sink TO-220 Aluminum 3.0W @ 30°C Board Level,...
DataSheet: 826002B05300 datasheet826002B05300 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 1.750" (44.45mm)
Diameter: --
Height Off Base (Height of Fin): 0.380" (9.65mm)
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential to the operation of electronic systems. Heat sinks are devices that are designed to dissipate the heat generated by electronic components and protect them from overheating and damage. The 826002B05300 is a type of heat sink designed to efficiently dissipate heat from high-power components, such as those found in a range of industrial and military applications. This article will discuss the 826002B05300’s application field and working principle.

Application Field

The 826002B05300 heat sink is primarily used in applications where high-power electronic components are used, such as automotive, military, industrial, and medical electronics. It is an ideal solution for applications such as LED drivers, power supplies, and air conditioning systems, which require the efficient dissipation of heat in a small form factor. The 826002B05300 also has applications in the home and office, where high-power components often need to be cooled. It is also often used in the field of mobile electronics, where space is at a premium and high-performance components need to be cooled.

Working Principle

The 826002B05300 heat sink utilizes a combination of heat dissipation technologies to effectively cool components. It utilizes a highly efficient heat sink that consists of an aluminum chassis with a set of aluminum fins. The fins provide a large surface area and help to dissipate heat more efficiently. Additionally, the fins are designed to maximize airflow, which helps increase the rate of heat dissipation. This makes the 826002B05300 heat sink an effective solution for cooling high-power components.

The 826002B05300 also utilizes a fan to facilitate heat dissipation. The fan draws in air from the sides of the heat sink and circulates it around the operating components. This helps reduce the temperature of the components by more effectively drawing out the heat produced by their operation. The fan is mounted directly to the heat sink so that it is constantly in contact with the hottest components, ensuring that it provides the most efficient cooling possible.

In addition to these cooling technologies, the 826002B05300 also uses an advanced thermal management system to further improve heat dissipation. This system uses sensors to detect the temperature of the components, and then adjusts the fan speed accordingly, ensuring that the components remain within their safe temperature range. This provides an added layer of protection for high-power components and helps to prevent them from overheating.

The 826002B05300 heat sink is an ideal solution for applications where high-power components need to be cooled efficiently. Its combination of heat dissipation technologies and advanced thermal management system make it a reliable and effective cooling solution for a range of applications. Whether it is being used in the automotive, medical, industrial or military sectors, the 826002B05300 can help ensure that components remain safe and protected from the effects of overheating.

The specific data is subject to PDF, and the above content is for reference

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