831502B03700 Allicdata Electronics
Allicdata Part #:

CR469-ND

Manufacturer Part#:

831502B03700

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 19X12.8X12.7MM
More Detail: Heat Sink TO-220, TO-262 Aluminum 1.0W @ 30°C Boar...
DataSheet: 831502B03700 datasheet831502B03700 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Width: 0.504" (12.80mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 400 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an important component in many applications. They are used to dissipate heat from a particular source in order to prevent overheating. The 831502B03700 heat sink is a versatile thermal management solution suited for many different applications. It is designed to be used in electrical circuit board applications as well as heat sensitive components. It is also suitable for other electronics applications such as LED lighting, cooling system fans, and more.

The 831502B03700 heat sink is made of high-performance aluminum and has a unique design that allows for efficient heat transfer. It consists of a large, flat aluminum rectangle cooled by a fan, and is designed to reduce power consumption in critical applications. The fan helps to move air around the sink, allowing for a more efficient heat transfer. The 831502B03700 heat sink also comes with integral thermal and conductive pads to allow for improved thermal contact between the heat sink and the device to be cooled.

The 831502B03700 heat sink offers a different thermal management solution than a typical heat sink. It is designed to absorb and dissipate a lot of heat in a short amount of time. It also provides a low profile, allowing it to be used in cramped spaces. The 831502B03700 heat sink is rated for a maximum ambient temperature of up to 249°F (121°C). This makes it ideal for use in hot climates or applications. The wide operational temperature range make the 831502B03700 heat sink an excellent choice for many applications.

The 831502B03700 heat sink works by absorbing the heat from the device being cooled and dissipating it into the ambient air. This is done through two different processes: convection and radiative cooling. Convection is the natural process of hot air rising and cool air falling. With the fan in the 831502B03700, hot air is forced away from the device and cool air is drawn in. Radiative cooling works by transferring energy away from the heat source through infrared radiation. This process is especially effective in environments with minimal air movement.

The 831502B03700 heat sink is a versatile thermal management solution that can be applied to many different applications. Its low profile and high efficiency make it an ideal choice for environments with limited space and high heat loads. It also has a wide operating temperature range allowing it to be used in almost any environment. The 831502B03700 heat sink is an excellent choice for many applications.

The specific data is subject to PDF, and the above content is for reference

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