833202B04800 Allicdata Electronics
Allicdata Part #:

CR487-ND

Manufacturer Part#:

833202B04800

Price: $ 0.48
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 10X21.2X19MM
More Detail: Heat Sink TO-220 Aluminum 3.0W @ 60°C Board Level,...
DataSheet: 833202B04800 datasheet833202B04800 Datasheet/PDF
Quantity: 924
1 +: $ 0.43470
10 +: $ 0.39690
25 +: $ 0.36061
50 +: $ 0.33352
100 +: $ 0.29749
250 +: $ 0.28398
500 +: $ 0.27046
Stock 924Can Ship Immediately
$ 0.48
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Width: 0.835" (21.21mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are used in a variety of electronic products to help dissipate excess heat and protect sensitive components from thermal damage. The 833202B04800 heat sink, specifically, is designed to provide reliable thermal management for products such as processors, transistors, and other high power components.

Application Field

The 833202B04800 heat sink is ideally suited for use in applications where heat dissipation and component protection are critical. This heat sink is especially suited for electronic devices driven by powerful processors or other heat-generating components, such as video game consoles, computers, and other consumer electronics. It is also a great choice for medical devices and other high-precision equipment, because it is designed to be reliably dependable and able to withstand long-term thermal loads. In addition, this heat sink is highly compatible with a variety of mounting methods, making it suitable for a variety of applications.

Working Principle

Heat sinks use a combination of surface area and airflow to reduce the temperature of the component being cooled. The 833202B04800 heat sink is designed to maximize the amount of surface area exposed to the airflow for maximum cooling efficiency. The device’s heatsink fins provide a large surface area for air to move through, and the fins are designed to transfer heat efficiently and evenly. The airflow provided by fans or other air circulation devices helps to remove the heated air and replace it with cooler air. In addition, the heatsink is designed with integrated heat pipes that help to further increase the device’s thermal efficiency by rapidly transferring heat away from the component and into the heatsink fins.

Conclusion

The 833202B04800 heat sink is a reliable thermal management solution that is suitable for reducing the temperature of high-powered components in a variety of applications. Its combination of heatsink fins and integrated heat pipes provide excellent thermal performance, and its versatility makes it an ideal choice for a variety of thermal management needs.

The specific data is subject to PDF, and the above content is for reference

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