833502B00000 Allicdata Electronics
Allicdata Part #:

CR490-ND

Manufacturer Part#:

833502B00000

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 9.5X22.8X17.8MM
More Detail: Heat Sink TO-220 Aluminum 2.0W @ 50°C Board Level,...
DataSheet: 833502B00000 datasheet833502B00000 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Clip
Shape: Rectangular, Fins
Length: 0.700" (17.78mm)
Width: 0.900" (22.86mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks

Heat sinks are essential components in the thermal management of electronic components and systems as they facilitate the dissipation of heat generated from these components. The 833502B00000 application field and working principle encompass the application of this type of heat sink in the thermal management of electronics, as well as its working principle.

Applications

Heat sinks are often used in a variety of electronics to manage the heat generated from the electronic components. Examples of often used components which require heat sinks in order to optimise its heat dissipation are power supplies, voltage regulators, lasers, microprocessors and other semiconductors. Depending on the component, the 833502B00000 is a multi-purpose heat sink that can be used for many of the above components.

Working principle

The 833502B00000 uses a two-phase cooling system which operates on convection. The heat sink is made up of a large metal block, usually constructed from aluminium or copper. This metal block is designed to retain. Heat, resulting from the electronics being cooled, flows from the device and is retained by the metal block. This heat is then dissipated into the environment via the the heat dissipation fins located at the top of the heat sink. These fins can be used to control the amount of heat that is radiated.

In addition, the heat sink also uses a fan to aid in the dissipation of the heat. The fan is used to direct the flow of air across the heat dissipation fins, increasing the cooling efficiency of the heat sink. This allows the heat to be dissipated quicker, thus reducing the temperature of the device.

Conclusion

The 833502B00000 application field and working principle combine to form an effective thermal management solution for electronics. By using the two-phase cooling system that consists of a metal block and heat dissipation fins, in addition to a fan, the 833502B00000 heat sink can effectively reduce the temperature of electronic components, making them more reliable and efficient.

The specific data is subject to PDF, and the above content is for reference

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