88083-14-19SN

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88083-14-19SN is an advanced surface mount technology (SMT) package form of the common tape automated bonding (TAB) process. It consists of a lead frame with a gold wire bond and an epoxy overcoat.

The 88083-14-19SN package is a shielded version of the standard 88083-14-19SN package, and is used for applications where additional shielding or other electrical requirements are needed. Examples of such applications that make use of this type of package are high performance embedded systems, powered instruments, and high speed components. It is typically used in portable electronics, medical instruments, telecommunication systems, and other applications requiring high performance and low power consumption.

The 88083-14-19SN package offers superior performance compared to other conventional SMT packages. The package is designed to provide a high thermal transfer rate, low power consumption, and an excellent electrical connection. It has a high operating temperature range and is highly reliable in long-term use.

In terms of working principle, the 88083-14-19SN is a symmetrical package form with a rectangular or square shape. Its leads are arranged in a tapered shape, which facilitates the solder joint forming process and makes it highly suitable for surface mount applications. The package also features an epoxy overcoat which protects the bond wires from damage and improves performance. Furthermore, the leads are designed for low inductive behavior and can be used for high frequency applications.

The 88083-14-19SN package can be directly attached to a substrate without any additional boards or components. This makes it ideal for applications where space is limited. Furthermore, the package is compatible with a wide range of devices due to its smaller form factor.

In conclusion, the 88083-14-19SN package is a versatile and reliable solution for a wide range of high performance applications. It is not only suitable for portable electronics, medical instruments, and telecommunication systems, but also for high frequency applications. Due to its symmetrical form, epoxy overcoat, and small form factor, it can be easily integrated into various systems with minimal issues.

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