91570-102LF

Backplane connectors are an important form of contact used in applications where electronic circuits need to be interconnected. 91570-102LF is one type of backplane connectors, ideally suited for applications where space is limited. This connector consists of an inner set of delicate yet resilient contacts held in place with an outer shell or housing that maintains electrical contact intervals. In this article, the application field and working principle of 91570-102LF will be explored.

Application Field

The 91570-102LF is a vertical stack right-angle floating backplane connector with a small form factor for space-constrained applications. It is available in a 28-terminal count in-line configuration and is RoHS-compliant. This connector is designed for easy and reliable stackability with other backplane interconnects. It offers a vertical stacking approach for applications that require minimization of the board-to-board interconnect area.

The 91570-102LF is suitable for a variety of applications, including medical, military, industrial, consumer and automotive sectors. Moreover, due to its small form factor, it fits in a variety of motherboards and provides enhanced airflow and thermal management. It is also a reliable choice for high-speed applications, because of its high tolerance for mechanical shock and vibration, as well as its shielding protection.

Working Principle

The 91570-102LF employs a variety of contact technologies to ensure dependable electrical performance and reliability in a wide variety of applications. It utilizes a number of contact technologies, including stamped contacts, insulation displacement connectors (IDCs) and soldered contact springs.

The stamped contact is made up of a bronze alloy with a nickel plating for corrosion protection. This contact is strong enough to provide reliable continuity of electrical signals. The IDC utilizes a combination of stamped and wire-wrap techniques to create reliable electrical contacts. Lastly, the soldered contact spring is designed to provide maximum contact force and secure electrical connection.

The 91570-102LF is also designed to provide enhanced airflow and thermal management, as well as improved signal integrity. Its signal integrity is achieved by its high manufacturing precision and ability to maintain straight signal paths with minimal interference. It also helps to dissipate heat, since the outer shell will act as a heat sink.

In conclusion, the 91570-102LF is a vertical stack right-angle floating backplane connector of small form factor, designed primarily for space-constrained applications. It is suitable for a variety of applications, including medical, military, industrial, consumer and automotive sectors. Its contact technologies include stamped contacts, insulation displacement connectors and soldered contact springs. It is designed to provide enhanced airflow and thermal management, as well as improved signal integrity.