A2F200M3F-FGG256 Allicdata Electronics
Allicdata Part #:

1100-1003-ND

Manufacturer Part#:

A2F200M3F-FGG256

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 256K FLASH 256FBGA
More Detail: ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusio...
DataSheet: A2F200M3F-FGG256 datasheetA2F200M3F-FGG256 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SmartFusion®
Packaging: Tray 
Part Status: Discontinued at Digi-Key
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)
Number of I/O: MCU - 25, FPGA - 66
Base Part Number: A2F200
Description

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A2F200M3F-FGG256, is a type of embedded system-on-chip (SoC). This chip is designed to integrate multiple processing tasks onto a single integrated circuit (IC). By doing so, the chip is able to perform multiple processing tasks quickly, conserving power and improving system performance. The A2F200M3F-FGG256 can be used for a variety of different applications, such as industrial, consumer, and automotive applications. This type of chip has a wide range of features, including: temperature and voltage sensors, embedded clock controllers, rich communication protocols, and high-performance memory controllers.

The A2F200M3F-FGG256 application field and working principle revolves around its embedded architecture. This architecture is designed to leverage a multiple core processor architecture to reduce power consumption and improve system performance. The A2F200M3F-FGG256 includes two processor cores. The cores are a Cortex-M3F and a Cortex-R4F, and each of them is optimized for specific tasks. The Cortex-M3F is designed for executing real-time code and the Cortex-R4F is designed for executing control code. The two cores are connected by an integrated interconnect, which allows for simultaneous and efficient data transfer between them.

The A2F200M3F-FGG256 also includes various peripherals and a range of memory controllers. These peripherals can be connected to the chip through standard interfaces such as I2C, SPI and UART, which enable high-speed communication between the various components. The chip includes an integrated analog-to-digital converter (ADC) and a digital-to-analog converter (DAC) that support a wide range of input and output signals. There are also memory controllers which enable the chip to manage high-performance memory, such as SRAM and flash memory. The A2F200M3F-FGG256 also has an integrated display controller for driving LCD and SVGA displays.

The A2F200M3F-FGG256 is designed to be used in a wide range of applications, from industrial to consumer and automotive. This type of chip is ideal for applications that require high-performance, low power consumption and reliable operation. The stand-out feature of this SoC is its ability to support multiple cores and peripherals, enabling it to perform multiple tasks in parallel. Additionally, its heterogeneous architecture allows teams to leverage the strengths of both its Cortex-M3F and Cortex-R4F cores. This combination of features makes the A2F200M3F-FGG256 an ideal solution for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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