ACML-0402-600-T Filters

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ACML-0402-600-T is a miniaturized surface mount ferrite bead used to suppress high frequency electromagnetic interference (EMI) in electronic systems like AD/DA converters, data communications, high-speed signal paths, etc. It is designed to eliminate noise and minimize the connection loss of the signal. With its small package size and high current rating, it is suitable for a variety of applications where a small package size is critical for achieving maximum circuit performance.

A ferrite bead is a passive component with a series inductor, which acts as an efficient low pass filter that can be used to suppress high frequency interference. It works by creating a magnetic field around the signal path, which the high frequency EMI has to pass through. The resistance of the ferrite bead increases with the frequency of the EMI so it effectively blocks unwanted frequencies from the signal path.

The ACML-0402-600-T is designed to provide maximum filtering performance in a very small package size. It has a low impedance, low inductance, and a high current rating of 17A. The low inductance enables the device to provide effective filtering over a wide range of EMI frequencies, while its higher current rating allows it to support high speed signal paths. The device also has a low power dissipation and low temperature rise, making it suitable for compact, space-constrained applications.

Moreover, the ACML-0402-600-T is designed for easy integration into existing systems. It can be soldered with standard techniques like reflow and wave soldering, and is compatible with lead-free soldering processes. The device is also RoHS compliant and Lead Free-halogen Free, making it suitable for a variety of end-products.

In summary, the ACML-0402-600-T is a versatile surface mount ferrite bead designed to provide effective EMI suppression in a small package size. With its low inductance, high current rating, and low power dissipation, it is suitable for a variety of applications, including AD/DA converters, data communication and high-speed signal paths. Additionally, its simple integration and compatibility with lead-free soldering processes make it ideal for a variety of end-products.

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