ADT7485AARMZ-REEL7 Integrated Circuits (ICs) |
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Allicdata Part #: | ADT7485AARMZ-REEL7TR-ND |
Manufacturer Part#: |
ADT7485AARMZ-REEL7 |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | ON Semiconductor |
Short Description: | IC TEMP/VOLT DGL SENS SST 10MSOP |
More Detail: | Temp Monitoring System (Sensor) -40°C ~ 125°C, Ext... |
DataSheet: | ADT7485AARMZ-REEL7 Datasheet/PDF |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Specifications
Topology: | ADC, Multiplexer, Register Bank |
Base Part Number: | ADT7485AA |
Supplier Device Package: | 10-MSOP |
Package / Case: | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 125°C |
Voltage - Supply: | 3 V ~ 3.6 V |
Output Fan: | No |
Output Alarm: | No |
Output Type: | Simple Serial Transport™ (SST) |
Series: | -- |
Accuracy: | ±1.75°C(Max) |
Sensing Temperature: | -40°C ~ 125°C, External Sensor |
Sensor Type: | Internal and External |
Function: | Temp Monitoring System (Sensor) |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Obsolete |
Lead Free Status / RoHS Status: | -- |
Packaging: | Tape & Reel (TR) |
Description
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PMIC-Thermal Management
The ADT7485AARMZ-REEL7 is part of a broad offering of Power Management ICs (PMICs) designed to improve power efficiency and system performance in thermal-sensitive applications. It is an integrated, multi-phase thermal management device that aggregates the high-level sensing and power conversion components necessary to efficiently regulate the total power dissipation across multiple packages, including those with high heat loads.
Thermal management is an important aspect of power management in current designs of electronics. The ADT7485AARMZ-REEL7 is designed to provide efficient thermal regulation for multiple package or CPU environments. The device is a low-cost solution for managing high-power, high-temperature zones in the system, such as in CPUs. It offers integrated time-of-flight maps and die-level temperature measurements to efficiently sense, adjust and manage thermal conditions.
The principle of operation for the ADT7485AARMZ-REEL7 is based on a multi-zone control strategy. It uses an on-chip temperature Measurement Method (TRM) with a temperature map and die-level temperature measurement to sense the CPU hotspots. It then adjusts the power allocation and operating temperature in response to changes in the thermal environment. This allows the device to manage the total power dissipation across packages with varying levels of power loads and temperatures.
Additionally, the device provides voltage and current monitoring functions, allowing the system to assess the power balance between different components. Furthermore, it offers a built-in Least Mean Squares (LMS) algorithm, which uses the power balance data to adjust the power allocation so that the total power dissipation is efficiently managed.
The ADT7485AARMZ-REEL7 package is ideal for thermal-sensitive applications such as desktop and notebook computers, monitors, and embedded systems. It is ideal for systems that require efficient and cost-effective thermal management across multiple thermal regions. Additionally, it is suitable for scenarios that require reliable, on-demand power optimization, such as dynamic frequency scaling applications.
In short, the ADT7485AARMZ-REEL7 is an ideal solution for applications requiring efficient thermal and power management. The device integrates multiple power conversion and sensing components onto a single chip and offers an efficient, low-cost solution for managing power in thermal-sensitive applications.
The specific data is subject to PDF, and the above content is for reference
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