AER40-40-21CB/A01

Series:	AER
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	1.559" (39.60mm)
Width:	1.559" (39.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.811" (20.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.12°C/W @ 200 LFM
Thermal Resistance @ Natural:	8.71°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction:AER40-40-21CB/A01 thermal - heat sinks are electronic components that are used in many areas of electronics engineering primarily to provide a stable environment for electronic devices. For instance, they may be used to dissipate heat away from electrical components, provide energy control during high speed operations, or dissipate electro magnetic interference.Application Field:AER40-40-21CB/A01 thermal - heat sinks are most commonly used in the cooling of electronic components such as CPUs, microprocessors, and power supplies. These thermal - heat sinks are made up of a base plate, normally aluminium in construction that sits directly on top of the component, and a finned heat pipe which is attached to the base plate. The purpose of the heat pipe is to dissipate the heat away from the component, through the fins and out into the surrounding air. As these thermal - heat sinks are constructed with materials that distribute heat well, and are able to handle a much higher power density than air-cooled devices, they can handle the thermal stress of a variety of electronics components.In addition to cooling components, AER40-40-21CB/A01 thermal - heat sinks may also be utilized for heat conduction or dissipation for a variety of purposes such as industrial lasers, medical equipment, or communication equipment. The thermal conduction properties of the material used to construct these heat sinks allow them to be embedded in specialized pieces of equipment to dissipate the heat away from sensitive components. The distribution of heat away from a point of focus also serves to reduce the stress that can be placed on the components or the entire system. Industrial applications of AER40-40-21CB/A01 thermal – heat sinks include a wide range of activities from gas and oil exploration to the automotive manufacturing industry. These thermal - heat sinks are used to keep the operational temperatures of critical equipment such as pumps, compressors, and motors. Without the thermal - heat sinks in place, the stress placed on the components would eventually lead to catastrophe, rendering the entire system useless.Working Principle:The working principles of AER40-40-21CB/A01 thermal - heat sinks is based on the transfer of heat through conduction. Heat is transferred from the electronic component or system to the heat sink through the base plate and finned heat pipes. The heat then passes through the finned plates, where it is dissipated out into the surrounding air through convection.The base plate is usually constructed of aluminium, which has an excellent heat transfer rate. As the heat passes through the base plate it is spread out over a larger surface area, increasing the overall thermal efficiency and allowing the heat to be dissipated out into the air at a quicker rate. The finned heat pipe also serves to provide additional thermal efficiency, as the fins help to guide the heated air away from the components and into the surrounding environment.The effectiveness of AER40-40-21CB/A01 thermal - heat sink depends on the size and shape of the components, as well as the environment in which they are used. For example, units in a high temperature environment will require a larger surface area to be able to dissipate the heat at a reasonable rate. Larger components, such as CPUs, will also require a larger sink to accommodate the increased power requirements. Finally, to ensure maximum efficiency of the AER40-40-21CB/A01 thermal - heat sinks is to make sure that the entire base of the unit is in full contact with the components and that the fan is mounted correctly. The fan should be pointed towards the finned plate, and has a low speed setting for maximum efficiency. Proper mounting of the fan will increase the air circulation around the sink and thus enhance the heat dissipation rate.Conclusion:AER40-40-21CB/A01 thermal - heat sinks are electronic components used to dissipate heat away from sensitive components and provide energy control during high speed operations. They can be used to cool down electronic components such as CPU, microprocessors, and power supplies. Additionally, they can be used for the heat conduction or dissipation in a variety of applications such as industrial lasers, medical equipment, and communication equipment. The working principle of these thermal - heat sinks is based on the transfer of heat through conduction, where the heat is spread out over a larger surface area, passing through the finned heat pipe and dissipated out into the air through convection.

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