Allicdata Part #: | AH10928V10000JE-ND |
Manufacturer Part#: |
AH10928V10000JE |
Price: | $ 58.14 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | ALUMINUM EXTRUSION 10" |
More Detail: | Heat Sink Aluminum Housed Resistor Aluminum Alloy ... |
DataSheet: | AH10928V10000JE Datasheet/PDF |
Quantity: | 29 |
1 +: | $ 52.85070 |
10 +: | $ 49.54640 |
25 +: | $ 46.24330 |
50 +: | $ 44.59180 |
100 +: | $ 42.94020 |
Series: | HS |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | Aluminum Housed Resistor |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 10.000" (254.00mm) |
Width: | 9.750" (247.65mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 2.280" (57.91mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Material: | Aluminum Alloy |
Material Finish: | Unfinished |
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Introduction
Thermal management is critical to the performance, lifetime, and safety of modern electronic components. Heat sinks are an effective and efficient way to dissipate trapped heat, and the AH10928V10000JE heat sink is a great example. This particular model is designed specifically to provide thermal relief to high-performance devices such as CPUs, GPUs, Chipsets, and ASICs. Let\'s explore the application field and working principle of this model.
Application Field
As mentioned, the AH10928V10000JE is specifically designed for high-performance devices. This type of heat sink can be used in applications where thermal energy dissipation is necessary. From cooling highly-advanced CPUs to helping to keep older processors from overheating, this heat sink easily covers a variety of needs. It is also suitable for use in enclosed spaces, such as gaming systems, where it is important to keep the heat levels low to maintain peak performance. Other applications include industrial equipment, automotive electronics, consumer electronics, and wireless communication.
Working Principle
The AH10928V10000JE works through a technology known as “thermal conduction”. Thermal conduction happens when a material conducts heat from one point to another. In this case, the heat generated by a device (either the processor or other electronic components) is transferred to the heat sink by its solid body. The heat sink then acts as a heat diffuser, transferring the heat to its surrounding environment. The result of this process is much cooler temperatures for the device, ensuring optimal performance and a longer lifespan.
Design Features
The AH10928V10000JE is a highly effective thermally-conductive heat sink that makes use of innovative design features. It is constructed from high-grade aluminum alloy and is coated in black anodized finish for excellent durability. The heat sink is also designed to have a low thermal resistance, meaning that the heat is effectively dissipated away from the device. Additionally, it has optimized fins to maximize heat dissipation, and its ultra-thin profile allows it to be mounted on devices with limited space.
Conclusion
Thermal-conductive heat sinks are essential components in any electronic system that requires cooling and the AH10928V10000JE is a great example. This particular model is suitable for a wide range of applications and makes use of an optimized design that provides high performance and reliability. As a result, it is an ideal choice for any high-performance device that needs heat dissipation.
The specific data is subject to PDF, and the above content is for reference
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