BDN09-3CB

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components in many applications needing to dissipate heat from components or other assemblies. Various materials and design solutions are available for such devices, and the BDN09-3CB heat sink is an example of an efficient cooling device with unique properties. It is constructed from die-cast aluminium and featuring a copper insert, which ensures a high level of thermal conductivity. The BDN09-3CB heat sink is designed to provide optimal cooling performance in many different applications.

The BDN09-3CB’s primary application field is within the automotive and consumer electronics industries where it is used to transfer and dissipate heat away from electronic components, such as MCUs and CPUs, or motors, amplifier systems. Overall, it has been found to provide a reliable, cost-effective solution to keep components operating within their optimum temperature range. In addition, the BDN09-3CB has also been tested for compatibility with fluids, and can be used as part of a cooling system for pumps. Other uses include providing heat dissipation in air conditioning and other HVAC systems.

The BDN09-3CB operates on the principle of convection, constantly circulating its stored heat up the aluminum block before it is dissipated away into the surrounding air. The copper insert, which is placed between an internal fin core and a bottom plate, also helps to facilitate a convective flow. As a result, the heat sink can effectively transfer and dissipate stored heat away from a component without leakage. Specialized fins provide additional surface areas, allowing the BDN09-3CB to be both smaller and lighter than many other heat sinks.

The BDN09-3CB’s shape and design offers advantages over other heat sinks, particularly when used in restricted spaces. Its designed shape allows it to easily be installed in cramped areas, and provides additional strength to components in such environments. The copper insert ensures maximum thermal conductivity without the need for extra components and heatsinks.

The BDN09-3CB is available in a range of sizes, with a peak cooling power of up to 225 watts. This allows it to be used in a broad variety of applications, providing efficient cooling for electronic components where space is a restriction. This heat sink also offers other advantages compared to traditional cooling solutions, such as its low cost, easy installation, and flexible configuration. As a result, the BDN09-3CB is a popular choice for cooling of electronic components and various systems requiring efficient heat dissipation.

The specific data is subject to PDF, and the above content is for reference