Allicdata Part #: | 568-1976-2-ND |
Manufacturer Part#: |
BFG310W/XR,115 |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | NXP USA Inc |
Short Description: | TRANS NPN 6V 10MA 14GHZ SOT343R |
More Detail: | RF Transistor NPN 6V 10mA 14GHz 60mW Surface Mount... |
DataSheet: | BFG310W/XR,115 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Packaging: | Tape & Reel (TR) |
Part Status: | Obsolete |
Transistor Type: | NPN |
Voltage - Collector Emitter Breakdown (Max): | 6V |
Frequency - Transition: | 14GHz |
Noise Figure (dB Typ @ f): | 1dB @ 2GHz |
Gain: | 18dB |
Power - Max: | 60mW |
DC Current Gain (hFE) (Min) @ Ic, Vce: | 60 @ 5mA, 3V |
Current - Collector (Ic) (Max): | 10mA |
Operating Temperature: | 175°C (TJ) |
Mounting Type: | Surface Mount |
Package / Case: | SC-82A, SOT-343 |
Supplier Device Package: | CMPAK-4 |
Base Part Number: | BFG310 |
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The BFG310W/XR,115 Transistor is an RF bipolar transistor (BJT) commonly used in various applications requiring high-frequency radio and television signals. It is a laterally diffused metal-oxide semiconductor (LDMOS) field-effect Transistor with a more compact layout and improved uniformity.
The features of this transistor are its higher breakdown voltage, low gate leakage and high transconductance. It also has higher thermal resistance, which helps in the stability of the overall device. The transistor is also characterized by its high-frequency stability.
The main application fields for this transistor are high frequency modulation, direct-conversion receivers and transmitters, low-IF receivers and wide-dynamic-range applications. These applications usually require high-frequency access, which is only provided by this type of transistor. In each application, its high thermal stability, superior breakdown voltage, and low gate leakage make it suitable for these types of applications.
The working principle of the BFG 310W/XR,115 transistor is based on the presence of the N-channel LDMOS structure. This structure is composed of a SiO2 layer on the surface of the epitaxial layer, and N-regions within the silicon substrate. This layer serves to provide electrical isolation between the gate and substrate, as well as to improve the uniformity of device characteristics. The source and drain regions are also provided in this structure.
When a voltage is applied to the gate, electrons are driven toward the source region and holes are attracted to the drain region. This results in a flow of current through the channel, hence creating an amplified current or voltage, depending on the application. The current and voltage are further amplified by the addition of the capacitance between the gate and substrate.
In conclusion, the BFG310W/XR,115 transistor is an RF bipolar transistor (BJT) with a high breakdown voltage, low gate leakage and high transconductance. Its main applications are high-frequency communication applications, direct-conversion receivers and transmitters, low-IF receivers and wide-dynamic-range applications. Its working principle is based on the presence of the N-channel LDMOS structure.
The specific data is subject to PDF, and the above content is for reference
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