BKAD1-125-30023

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BKAD1-125-30023 application field and working principle

ARINC (Aeronautical Radio, Inc.) backplane connectors are widely used in the aircraft industry. The interconnects based on them are similar to printed circuit boards, but much more reliable and efficient. These backplane connectors are mainly used in applications that require high reliability and where space is a concern. Examples of such applications include flight controls, onboard systems, and other critical systems.

ARINC backplane connectors should be used in order to guarantee the system’s reliability. They are designed to be highly corrosion resistant and to provide a very low level of electrical interference between different signal lines. Moreover, these connectors deliver high signal integrity even in extreme environmental conditions.

The backplane connectors of the ARINC series come in different types, shapes, and sizes. The type of connector used depends on the application and size of the system. For instance, if an application is extremely compact, the Micro-ARINC Backplane Connectors are the ideal choice. On the other hand, if an application requires higher power densities and more contact points, then Large and Mini-ARINC Backplane Connectors should be used to fulfill the requirements.

These connectors achieve their power density and contact-point density through an innovative design which combines a number of positive features. Thanks to features such as complex motherboards, high-density interconnects, and integrated power and signal paths, these connectors are able to achieve very high performance levels while remaining compact and lightweight. Moreover, their contact-point geometry ensures high current and signal integrity.

The working principle of ARINC backplane connectors is based on electrical and mechanical elements. These connectors employ a spring-loaded, pressure-pleated design which provides a low-voltage connection between the module and the motherboard. This connection guarantees a highly reliable and efficient electrical connection. When this connection is established, the low-voltage connection provides sufficient contact force to ensure reliable operation.

The connection between the module and the motherboard is maintained by the spring-loaded pressure-pleated design. The module is inserted into the motherboard, and as the module moves, the contact points are pressed together and the connection is made. This connection is maintained even under vibration and thermal cycling conditions.

In conclusion, ARINC backplane connectors are a reliable and efficient way to interconnect electronic systems. They are designed to provide a high level of electrical and mechanical reliability in extreme environmental conditions. Furthermore, their high power and contact-point densities are perfect for today’s demanding applications as well as the future development of the aircraft industry.

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