| Allicdata Part #: | BKAE1-125-30001-ND |
| Manufacturer Part#: |
BKAE1-125-30001 |
| Price: | $ 0.00 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | ITT Cannon, LLC |
| Short Description: | RP BKAE1 PLUG |
| More Detail: | Plug Connector Arinc Crimp 60/60/5W2/// |
| DataSheet: | BKAE1-125-30001 Datasheet/PDF |
| Quantity: | 1000 |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| 1 +: | 0.00000 |
| Series: | 600 BKA |
| Packaging: | Bulk |
| Lead Free Status / RoHS Status: | -- |
| Part Status: | Active |
| Shell Style: | Plug |
| Class: | Environmental |
| Class Code: | E |
| Shell Size: | 1 |
| Cavity A: | 60 |
| Cavity B: | 60 |
| Cavity C: | 5W2 |
| Cavity D: | -- |
| Cavity E: | -- |
| Cavity F: | -- |
| Sealed: | Sealed |
| Shell Plating: | Chromate |
| Termination: | Crimp |
| Features: | Rear Release |
| Note: | -- |
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Backplane Connectors - ARINC
The BKAE1-125-30001 is an ARINC backplane connector that provides reliable signal connections between multiple printed circuit boards. It is well suited for applications requiring strict signal integrity among multiple boards within a single chassis. ARINC backplane connectors are widely used in a variety of industries, including the aerospace, medical, industrial, and military sectors.
Application Field
This ARINC backplane connector is designed for high speed, reliable signal transmission between multiple printed circuit boards. As such, it is commonly found in high-bandwidth applications such as avionics, flight control systems, and automotive infotainment systems. Additionally, this connector is typically utilized in low-level signal transfer applications in servers, data centers and communication equipment.
Working Principle
The BKAE1-125-30001 is a multi-pin backplane connector with a shielded plug and jack layout that facilitates high-speed signaling between multiple boards. The wide range of pins (up to 125) ensures that the connector’s data bandwidth is sufficient even in high speed applications. Additionally, the sizable contact spacing allows for increased current on the connector, thus facilitating power transfer between circuit boards.
The wide range of pins also facilitate better grounding and improved EMI/RFI shielding by allowing multiple contacts to create a ground plane. This shielding, in turn, prevents crosstalk and improves signal integrity for the multiple boards connected together in a single chassis. Additionally, the connector is shipped with a molded plastic housing that enhances the connector’s robustness and contributes to its reliability.
To ensure that the connector is able to efficiently facilitate high-bandwidth communication between circuit boards, each pin is equipped with a gold plated contact that is designed for robust durability. The gold plating increases the life of the contact and also provides a higher reliability index. Furthermore, the shielding on the contact helps reduce reflection that might otherwise cause signal corruption.
Conclusion
The ARINC BKAE1-125-30001 is an extremely reliable and versatile backplane connector that is well suited for a variety of applications requiring high speed, reliable signal transfer between multiple printed circuit boards. It features a high-density design with a wide range of pins, thus ensuring that the data bandwidth is sufficient for most applications. Additionally, the shielding on the contact reduces reflection and crosstalk, thus improving signal integrity. The superior contact technology and the molded housing also contribute to the robustness and reliability of the connector.
The specific data is subject to PDF, and the above content is for reference
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BKAE1-125-30001 Datasheet/PDF