BU8871F-E2 Allicdata Electronics
Allicdata Part #:

BU8871F-E2-ND

Manufacturer Part#:

BU8871F-E2

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: ROHM Semiconductor
Short Description: IC DTMF RECEIVER SOP18 TR
More Detail: Telecom IC Receiver, DTMF 18-SOP
DataSheet: BU8871F-E2 datasheetBU8871F-E2 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Obsolete
Function: Receiver, DTMF
Interface: --
Number of Circuits: 1
Voltage - Supply: 4.75 V ~ 5.25 V
Current - Supply: 2.2mA
Power (Watts): 550mW
Operating Temperature: -10°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 18-SOIC (0.213", 5.40mm Width)
Supplier Device Package: 18-SOP
Includes: --
Base Part Number: BU887*
Description

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BU8871F-E2 Application Field and Working Principle

BU8871F-E2 is a new generation of 4G communication chip from Panasonic. It is widely used in 4G communication systems both in industrial applications and in the daily life. It is an integrated chip for the development of high performance, efficient and reliable systems. This article will discuss the application field of the chip and its working principle.

BU8871F-E2 is a multi-mode, multi-band transceiver chip designed for LTE/LTE-Advanced applications. It supports both FDD and TDD mode, making it flexible and suitable for different applications. It supports a wide frequency range of 698-960 MHz, 1695-2170 MHz, 1710-2170 MHz and 2496-2690 MHz. It also supports multiple services like voice, data, audio and video signals etc.. What’s more, the chip is capable of meeting the requirements of mobile phones and mobile networks with advanced features like multi-user performance, backward compatibility, and low power consumption.

The chip is also compatible with multiple radio access network technologies such as WCDMA, HSPA/HSPA+, TDD LTE/LTE-Advanced. This means that it provides a unified and streamlined solution for different types of communication networks. What’s more, the chip boasts a low power consumption, making it suitable for use in battery powered products such as phones and tablets.

Now let us take a look at how the BU8871F-E2 chip works. First of all, it establishes the channel between the base station and the end user device. Then it receives signal from the base station, which is then converted from analog signal to digital signal. Next the signal is translated into desired services. The chip also has power control features to optimize signal strength and power consumption. Finally, the signal is received by the end user device and converted back to analog signal for further processing.

In conclusion, the BU8871F-E2 chip is ideal for LTE/LTE-Advanced applications. It supports multiple radio access network technologies, has an efficient and low power consumption, and delivers improved performance. It also caters to various services like voice, audio and video signals. And with its powerful features and advanced working principle, it is sure to meet the needs of various applications in the communication field.

The specific data is subject to PDF, and the above content is for reference

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