C220-050-2AE

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Thermal-Heat Sinks guarantee the optimal heat transfer and are often used in applications where it is necessary to cool components with high thermal loads such as in the electronics industry. C220-050-2AE is a thermal-heat sink manufactured by TSL Products that has been designed to help create greater efficiency and reliability in such applications by allowing an accelerated cooling time. The C220-050-2AE heat sink features pins with standard 6mm pitch and provides an optimal heat dissipation surface.

Application Fields

The C220-050-2AE is used in various application fields, including but not limited to:

• Electronic Components Cooling: C220-050-2AE heat sinks are mainly used to dissipate heat generated in high-power electronic components, such as transistors, power resistors, capacitors, voltage regulators, etc. This is because the C220-050-2AE has a high thermal conductivity, which allows it to quickly dissipate the heat generated by the components.
• DC Motors and Machines: C220-050-2AE is also used in DC motors and machines to dissipate the excessive heat generated due to frequent operations. This is due to the same reason as with electronic components – its high thermal conductivity.
• Power Supplies and Transformers: C220-050-2AE can be used to cool down and protect power supplies and transformers from excessive temperatures. This is largely due to how it is designed to increase the heat dissipation surface in order to accelerate its cooling time.

Working Principle

The C220-050-2AE heat sink works on the principle of thermal-heat transfer which relies on the physical mechanisms of conduction, convection and radiation to dissipate the heat from the components that it is attached to. The device consists of a body and pins which are arranged in a specific way so that they provide greater efficiency in heat dissipation. The long and widely spaced pins of the C220-050-2AE heat sink increase the heat dissipation surface of the sink and thus allow for faster cooling time of the components.

In applications such as electronic components cooling, the heat from the components is conducted to the body of the heat sink through the pins. Once the heat reaches the body of the heat sink, it then dissipates through a combination of convection and radiation. Convection is the transfer of heat produced by the circulating air, while radiation is the transfer of heat by electromagnetic waves between two materials with different temperatures.

The C220-050-2AE heat sink also has an increased surface contact area as compared to other heat sinks. This allows accelerated heat transfer between the pins and the body, which makes it much more efficient in dissipating the heat from the components.

Conclusion

The C220-050-2AE heat sink is an excellent option for dissipating heat generated in various applications and is used in a wide range of industries. The device is designed with long, widely spaced pins to increase its heat dissipation surface and improve its cooling time. It works on the principle of thermal-heat transfer and is effective in transferring heat between the body and pins, providing greater efficiency in cooling components with high thermal loads.

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