C247-050-2VE

Series:	C
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-247
Attachment Method:	2 Clips and PC Pin
Shape:	Rectangular, Fins
Length:	1.969" (50.00mm)
Width:	1.500" (38.10mm)
Diameter:	--
Height Off Base (Height of Fin):	0.710" (18.03mm)
Power Dissipation @ Temperature Rise:	2.5W @ 30°C
Thermal Resistance @ Forced Air Flow:	5.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Degreased

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Introduction

C247-050-2VE is a thermal-heat sink designed to address thermal management in a range of electronic applications. It offers a range of cooling options without the need for active cooling methods. C247-050-2VE employs the natural convective cooling process, also known as natural convection cooling, to dissipate heat effectively and efficiently. This thermal-heat sink is designed to maximise heat transfer from electronic components to a larger area of the thermal sink’s surface, allowing for significant cooling in a wide range of temperatures. The primary purpose of using this thermal-heat sink is for cooling of high-power components, such as those found in power amplifier applications, in a confined environment.

Application Field

C247-050-2VE thermal-heat sink is designed for cooling applications involving high-power components, such as those found in power amplifier applications. It is suitable for use in a range of different devices and products, such as but not limited to, automotive, medical, lighting, and communication systems. Additionally, C247-050-2VE can be used in any application requiring efficient heat dissipaion, such as microprocessor and memory modules, LED lighting, and IC packages.

Working Principle

The working principle of C247-050-2VE thermal-heat sink is based on natural convection cooling. Natural convection cooling is a type of cooling mechanism that uses the natural flow of air in a confined space to cool electronic components. The air, due to its buoyancy, rises to create an airflow current. This rising warm air draws more cooler air from the environment into the confined space, creating a continuous cycle. This cycle of air helps to dissipate heat from the device more efficiently and quickly than if the device was cooled passively.C247-050-2VE has an open cross-section with louvers & fins which are strategically placed to maximize the heat transfer area of the thermal-heat sink. The louvers and fins also divide the airflow current into smaller channels, resulting in more efficient cooling. Due to the multi-directional airflow design, the air also helps to cool components such as electrical connections, which helps to reduce the risk of overheating.In addition, C247-050-2VE has an anodized aluminum housing which provides protection and strength to the sink. Additionally, the anodized aluminum housing helps to improve thermal conductivity and overall performance.

Conclusion

C247-050-2VE is an ideal thermal-heat sink for high-power electronic and electrical applications. It is designed to increase thermal conductivity and performance, while offering natural convective cooling, which is more efficient than passive cooling methods. Due to its design and anodized aluminum housing, C247-050-2VE is also highly durable and reliable.

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