Allicdata Part #: | CSM222-30AE-ND |
Manufacturer Part#: |
CSM222-30AE |
Price: | $ 0.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | HEATSINK BLACK ANODIZED |
More Detail: | Heat Sink TO-220 Aluminum 5.0W @ 60°C Board Level,... |
DataSheet: | CSM222-30AE Datasheet/PDF |
Quantity: | 2133 |
1 +: | $ 0.59850 |
10 +: | $ 0.56700 |
25 +: | $ 0.53878 |
50 +: | $ 0.52454 |
100 +: | $ 0.51742 |
250 +: | $ 0.48195 |
500 +: | $ 0.45360 |
1000 +: | $ 0.41108 |
5000 +: | $ 0.39690 |
Series: | CSM |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Solderable Feet |
Shape: | Rectangular, Fins |
Length: | 1.173" (29.80mm) |
Width: | 0.562" (14.27mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.228" (31.20mm) |
Power Dissipation @ Temperature Rise: | 5.0W @ 60°C |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 11.30°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Heat sinks are a type of cooling device used to manage the heat generated by electrical and electronic components. They are used in a variety of fields, including industrial, consumer and military applications. The CSM222-30AE is a high-performance heat sink and sink assembly designed for power amplifier transistors and Industry Standard FETs. It is well-suited for applications requiring increased thermal performance in enclosed and confined space constraints.
The CSM222-30AE is a compact, two-piece thermal-electric heat sink and sink assembly. It is made of a copper top heat sink and a nickel-plated aluminum base. The two pieces are bolted together for a secure connection and to minimize thermal resistance. The base plate has a thermally conductive elastomer pad to ensure secure contact between the device and the base heat sink.
The CSM222-30AE is designed for optimal cooling performance. It has a generously sized base area that allows the heat to dissipate more effectively than with other designs. The top heat sink has a deep-drawn profile and optimized fin orientation to maximize convection cooling. The heat sink also utilizes a pinned lug feature to anchor the base plate against vibration. This helps reduce temperatures by preventing the assembly from moving during operation.
The cooling power of the CSM222-30AE is determined by measuring the thermal resistance of the assembly. Thermal resistance is the amount of heat that needs to be removed in order for the component to remain stable at the designed operating temperatures. The CSM222-30AE has a thermal resistance of 0.07°C/W which is a very good level for an enclosed or confined space. This helps it to provide highly efficient cooling. In addition, the assembly has a maximum power dissipation of 50W which gives it the capability to handle high power loads.
The CSM222-30AE is designed to be easy to install and maintain. It is provided with screw holes to ensure easy installation. It also comes with a double-contact terminal for easy connection between the heat sink and a power source, and if needed a fan can be mounted to the heat sink with screws. The assembly is also designed to Prevent Fiberglass debris inflection damage, using a safety filter.
The CSM222-30AE is an ideal solution for most applications that require efficient cooling in confined or enclosed spaces. It is well-suited for use in consumer electronics, amplifiers, and other industrial and military applications. It has a low thermal resistance, a generous base area, and an optimized fin design that allow for efficient cooling of components. It is also easy to install and maintain and comes with a safety filter to prevent debris inflection. The CSM222-30AE is the ideal choice when space is limited and high performance thermal management is desired.
The specific data is subject to PDF, and the above content is for reference
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