D10650-40T4E

Series:	Deltem™
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	0.650" (16.51mm)
Width:	0.650" (16.51mm)
Diameter:	--
Height Off Base (Height of Fin):	0.400" (10.16mm)
Power Dissipation @ Temperature Rise:	2.0W @ 40°C
Thermal Resistance @ Forced Air Flow:	25.00°C/W @ 350 LFM
Thermal Resistance @ Natural:	--
Material:	Composite
Material Finish:	--

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Thermal - Heat Sinks play a key role in helping components dissipate waste heat generated during their operation. In particular, the D10650-40T4E is a type of thermal- heat sink that is designed for applications involving high-power units with high levels of thermal dissipation requirements. This article will explain the application field and working principle of the D10650-40T4E thermal- heat sink.

The D10650-40T4E is primarily designed for applications involving power semiconductor modules such as IGBT, Mosfets, SiC, Diodes and TRIACs. It can be used in a variety of electronic products such as power supplies, DC-DC converters, transformers, power adapters, motor drives, lighting systems, automotive electronics, telecommunication systems, industrial products, consumer electronics, medical electronics, and other high-power products.

The working principle of the D10650-40T4E is based on the principle of thermoelectricity, which is the study of heat and electricity and their conversion into each other. When a material is exposed to a temperature gradient, it will produce an electric current. The D10650-40T4E utilizes this principle to efficiently dissipate the heat generated by high-power units.

The D10650-40T4E works by creating a special air-flow pattern around the components. The air-flow created by the D10650-40T4E is made up of a combination of natural convection, conduction, and radiation. This helps to effectively dissipate heat from the components and minimize their operating temperatures.

The main advantage of the D10650-40T4E is its heat dissipating capabilities which allow it to effectively cool high-power electronics. The thermal-heat sink is also highly reliable and durable as it is manufactured using advanced materials such as aluminum, copper, and thermoplastic. It can also be customized to fit the design of any specific product.

In conclusion, the D10650-40T4E thermal-heat sink is an ideal choice for applications involving high-power units due to its superior heat dissipating capabilities. Its reliable and durable design allow it to offer reliable performance for a wide variety of high-power electronics.

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