Allicdata Part #: | D10850-40T1E-ND |
Manufacturer Part#: |
D10850-40T1E |
Price: | $ 1.98 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK 128PQFP COMPOSITE |
More Detail: | Heat Sink BGA Composite 2.5W @ 90°C Top Mount |
DataSheet: | D10850-40T1E Datasheet/PDF |
Quantity: | 1000 |
513 +: | $ 1.78069 |
Series: | Deltem™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 0.850" (21.59mm) |
Width: | 0.850" (21.59mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.400" (10.16mm) |
Power Dissipation @ Temperature Rise: | 2.5W @ 90°C |
Thermal Resistance @ Forced Air Flow: | 20.00°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Composite |
Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The D10850-40T1E is part of the Thermal series. Heat sinks are used to absorb thermal energy, typically from electronic components, to keep them from overheating. Heat sinks vary in design and application depending on the type of material they are made of, their size, and the level of heat dissipation required. D10850-40T1E is made from aluminum alloy, has a 40 mm diameter and comes with a standard one year warranty.
This type of heat sink is used primarily for applications such as cooling computer processors, computer memory, and other electronic components with a high-temperature requirement. Heat sinks are also commonly used to protect delicate electrical components from overheating or other damage caused by prolonged exposure to excessive levels of heat. Heat sinks are also used to reduce air pollution by helping reduce the amount of energy required to maintain a desired temperature.
The working principle of the D10850-40T1E heat sink is simple. Heat is transferred away from the object being cooled, and dissipated into the atmosphere. This heat transfer process is known as conduction and involves the transfer of heat energy from one material to another. Heat from the object being cooled is transferred through the heat sink, which serves as a thermal medium, and then released into the atmosphere. This process helps maintain a desired temperature for the object being cooled and prevents it from overheating.
The main application of this type of heat sink is cooling computer components. The D10850-40T1E is designed to dissipate large amounts of energy in a short period of time. The heat sink is made using an efficient thermal transfer material to ensure maximum cooling performance. This heat sink is also constructed with a low-noise profile to ensure quiet operation.
Typically, the D10850-40T1E heat sink is installed over CPU, graphics cards, and other electrical components that require cooling. The heat sink is attached to the component using a mounting system or clips, depending on the model. Once installed, the heat sink begins to dissipate the heat away from the object being cooled and into the atmosphere, thus keeping the electronic component running at its optimal temperature.
The installation process of the D10850-40T1E heat sink is relatively straightforward. All necessary hardware and instructions are included with the heat sink. Before the installation, the user should take care to check the compatibility of the heat sink with the rest of the system. Additionally, installation should be done in a dust-free environment to ensure maximum cooling performance.
The D10850-40T1E heat sink is designed for applications requiring superior cooling performance. It is made from an efficient thermal transfer material and is designed to dissipate large amounts of energy in a short period of time. This heat sink is also constructed with a low-noise profile to ensure quiet operation. The heat sink is easy to install and comes with a standard one year warranty.
The specific data is subject to PDF, and the above content is for reference
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