D83032B-46R

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Sockets for ICs, transistors and other components are essential components with vital roles in any electronic device. The D83032B-46R socket is an example of such a component with its specialized role in device applications. This document looks at the application field and working principle of the D83032B-46R socket.

The D83032B-46R socket, manufactured by ADMtek, is a low-profile horizontal mount socket designed for low density application. It is intended for use with un-dipped devices such as CLCC, TSSOP, QFN and DFN packaged ICs and transistors. It features a leadframe based design integrated with a leadframe-to-bezel interface that ensures superior ESD performance. The presence of side walls also ensures a secure fit between the socket and the device. The D83032B-46R is available in two variants, one with 28-pins and another with 36-pins.

The primary application field for the D83032B-46R sockets is the consumer electronics industry. It is an ideal choice for use in portable consumer devices such as smartphones, tablets, games consoles and appliances. Its low-profile design makes it suitable for high-density circuit board designs. It is also suitable for applications requiring high flexibility and durability such as in products that require frequent upgradation.

The working principle behind the D83032B-46R Socket is grounded on the leadframe based design integrated with a leadframe-to-bezel interface. The leadframe based design ensures superior contact force between the pins of the IC/transistor and the socket, and also provides high signal integrity. The integrated leadframe-to-bezel interface further increases signal integrity by providing immunity from ESD events. The side walls of the socket ensure secure fit between the socket and the device, making it suitable for highly demanding applications.

The D83032B-46R is a low-profile horizontal mount socket with optimized design for use with un-dipped devices such as CLCC, TSSOP, QFN and DFN packaged ICs and transistors. It is ideal for use in low-density applications where high flexibility and durability is required such as in portable consumer devices. The leadframe based design integrated with leadframe-to-bezel interface provides superior contact between IC/transistor and socket pins along with immunity from ESD events. The presence of side walls ensures secure fit between the socket and the device, making this socket an ideal choice for highly demanding applications.

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