DBV13W3P500G30LF Connectors, Interconnects

D-Sub connectors are one of the most popular types of connectors used on many electronic devices today, such as computers, peripherals, and even some types of medical instrumentation. The DBV13W3P500G30LF is a D-Sub connector with a marked draft protection rating of IP30. It is designed to provide reliable connections in high-voltage and high-frequency applications.

Application Field

Due to its features, the DBV13W3P500G30LF is commonly used across multiple industries. Specifically, this type of connector is commonly used in industrial automation, automotive, mechanical engineering, telecommunications, renewable energy, and heavy-duty applications. The main applications where this specific model of D-Sub connector is used include process, assembly, and distribution systems.

Working Principle

The DBV13W3P500G30LF is a crimped D-Sub connector. It consists of two parts: the contact and the body. The contact is made from a copper alloy and is designed to ensure a reliable connection from one system to another. The body of the connector is made of die-cast zinc alloy and features a built-in strain relief. This design allows the connector to withstand a significant amount of pressure, making it suitable for use in high-vibration applications.

The DBV13W3P500G30LF features a high-speed data transmission over Ethernet and higher data rates of up to 100 Mbps. This connector also features shielded cable-to-connector coupling, which ensures a reliable connection for applications where data security is critical. Additionally, the connector also has a VDE/EN/IEC certification for safety and it complies with various international standards.

Overall, the DBV13W3P500G30LF is an ideal solution for applications in harsh environments. Its rugged design ensures reliable connections in a wide variety of industrial environments and its flexible design allows it to be used in many different applications. With its many features, it is sure to provide a reliable and secure connection for your application.