Allicdata Part #: | DEA9PF0-ND |
Manufacturer Part#: |
DEA9PF0 |
Price: | $ 0.00 |
Product Category: | Uncategorized |
Manufacturer: | ITT Cannon, LLC |
Short Description: | DSUB 9 M CRIMP F0 ZINC |
More Detail: | N/A |
DataSheet: | DEA9PF0 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | * |
Part Status: | Active |
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DEA9PF0 belongs to a family of products including Dage Electronics Assembly Products, often referred to as DEAPs. This product is used for surface mount and ball grid array assembly. The assembly process involves the integration of components onto printed circuit boards (PCBs) in a consistent manner. The DEAPs range of products combine high accuracy with fast speed for high-volume production.
Due to its small size, the DEA9PF0 is commonly used in applications which call for high precision and accuracy and are particularly suited for surface mount technology. Its components come in a variety of sizes and styles and are specifically designed for surface mount assembly processes. The DEAPs range of products is designed to meet the demands of today\'s applications, with features such as high speed assembly, reduced inventory costs, and quicker cycle times.
Working in conjunction with other components, the DEA9PF0 provides a fast and accurate way to assemble products on the surface of a PCB. The DEA9PF0 consists of two main components. The base module contains the component holder and the component carrier. This component holder is used to align the components with the tracks on the PCB and the component carrier is used to move the components to their correct positions. During assembly, the base module and the component holder are used to ensure the components are in the correct positional to ensure perfect alignment.
The DEA9PF0 also includes a range of other accessories such as programming software and various adapter plates. These plates are designed to work with different types of components. The programming software is used to program the assembly parameters, such as the position of the components and the number of components needed for assembly. This enables the user to quickly and accurately set up the assembly process.
To ensure the highest quality and reliability, the DEA9PF0 is manufactured using advanced semi-conductor technologies and state-of-the-art production techniques. This helps ensure the highest level of accuracy and consistency during assembly. The DEAPs range of products is built to last, meaning it can be used for a variety of applications. Whether it is used in an industrial application or in a consumer product, the DEA9PF0 ensures a perfect fit every time.
The DEA9PF0 is a versatile device and can be used in a wide range of applications. It is suitable for both traditional and modern assembly processes, so it can be used in industries such as automotive, electronics, and medical, as well as in consumer products. As the device is highly accurate and fast, it is particularly suitable for high-volume production processes.
The DEA9PF0 is also easy to maintain as its components are designed for easy replacement and refurbishment. This enables the user to keep the device functioning efficiently and prevent errors which may occur during assembly. The DEA9PF0 also comes with a range of support options, so the user can get help when they need it most.
In conclusion, the DEA9PF0 is a versatile surface mount and ball grid array assembly product which combines precision and speed in order to meet the demands of a wide range of applications. It is highly reliable, easy to maintain, and can be programmed to produce consistent results with every assembly.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
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DEA9PK87F0 | ITT Cannon, ... | 1.36 $ | 1188 | DSUB 9 M CRIMP F0 TINHous... |
DEA9PF0 | ITT Cannon, ... | 0.0 $ | 1000 | DSUB 9 M CRIMP F0 ZINC |
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