DEM09SN Allicdata Electronics
Allicdata Part #:

DEM09SN-ND

Manufacturer Part#:

DEM09SN

Price: $ 13.01
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN DSUB RCPT 9POS STR SLDR CUP
More Detail: 9 Position D-Sub Receptacle, Female Sockets Connec...
DataSheet: DEM09SN datasheetDEM09SN Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
180 +: $ 11.82130
Stock 1000Can Ship Immediately
$ 13.01
Specifications
Features: --
Backset Spacing: --
Contact Material: Brass
Wire Gauge: --
Housing Material: Thermoplastic
Contact Form: --
Color: --
Voltage Rating: 300V
Operating Temperature: -55°C ~ 125°C
Current Rating: 7.5A
Material Flammability Rating: UL94 V-0
Ingress Protection: --
Contact Finish Thickness: --
Contact Finish: Gold
Shell Material, Finish: Steel, Yellow Cadmium Plated
Series: DM HE508
Termination: Solder Cup
Flange Feature: Housing/Shell (Unthreaded)
Mounting Type: Free Hanging (In-Line)
Contact Type: Signal
Shell Size, Connector Layout: 1 (DE, E)
Number of Rows: 2
Number of Positions: 9
Connector Type: Receptacle, Female Sockets
Connector Style: D-Sub
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Tray 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The D-Sub Connectors family of products contains a wide variety of connectors primarily used in the computer industry. The various D-Sub Connector members are typically classified by gender, size, and number of pins or contacts. Some of the members in this family use metal retention screws to secure mating cables, while other members utilize latching mechanisms to latch two connectors together. The DEM09SN is part of this extensive product family and offers a high-density design with over 600 contacts in one size, allowing it to take up less space in applications. This article provides an explanation of the DEM09SN application field and working principle.

Applications and Use Cases

The DEM09SN is particularly well suited for applications that require high-density connections, such as large-scale data processing and machine vision systems. It is also useful in applications where the connected equipment needs to be separated or located at a distance such as large robotics factories. The DEM09SN is also suitable for applications including medical imaging, life science, imaging and motion control, and multiple types of test-and-measurement applications. All of these applications require reliable and robust high-speed connections.

The DEM09SN\'s compact design allows it to be installed in array configurations and offers flexibility for board space. It is designed to satisfy a range of performance requirements, from high speed, low power consumption, to low speed, high data throughput, and low noise levels.

Working Principle

The DEM09SN was designed with the purpose of combining high-density with high reliability and flexibility while minimizing contact size. It accomplishes this by using a “2X+” array of contacts – five pins in each “aspect ratio”. This ensures that the connector can maintain excellent contact spacings, minimizes the volume of the contact, and provides superior protection against dust and other contaminants. In addition, the contact material is made of a high-grade, cold-pressed or stamped copper alloy with gold plating.

The contacts are designed so that electrical power and data flow in one direction via discrete connectors. This design prevents any chance of reversed polarity, something that can be a problem with other designs. The DEM09SN board-to-board mating interfaces also permit easy assembly, as each exact-fit connector of the DEM09SN family is designed to match the board it is placed on.

The connector’s retention system operates similarly to a sheet of paper being held together by staples, where the connector is held to the board by four retention screws and two latching mechanisms. The DEM09SN’s spring-stamping technique increases the contact’s current carrying capacity by over 20%. Consequently, it is possible to make connections to/from higher currents compared to many other connectors.

Conclusion

The DEM09SN is a high-density connector designed for modern applications where high-speed data transfer and low power consumption are necessary. It offers flexibility in terms of board space, simplified assembly, and superior protection against dust. Its “2X+” array of contacts and cold-pressed/stamped contact material combine to increase current carrying capacity by over 20%. With its various attributes and features, the DEM09SN is perfect for applications that require multi-pin connections.

The specific data is subject to PDF, and the above content is for reference

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