DF18C-60DP-0.4V(81)

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The Arrays, Edge Type, Mezzanine (Board to Board) provide a secure option for board-to-board connections without the need for wires or cables. The DF18C-60DP-0.4V(81) is a rectangular connector type from this range, offering options for high-speed, high-density applications. This article looks at the application field and working principle of the DF18C-60DP-0.4V(81).

Application Field

The DF18C-60DP-0.4V(81) is primarily used in high-speed, high-density applications such as communications and networking. It is designed to meet the demands of today’s complex electronics systems, multiple board connections and cable and wire management. The device is suited to applications such as digital signal processing, high-speed data transfers, fault tolerant connections and even self-service kiosks.

The DF18C-60DP-0.4V(81) offers a secure connection, with shielding from both mechanical and electrical interferences. This is essential for the dependable performance of systems, as interference from outside sources can disrupt the signal and cause a poor user experience. The connector provides full 360-degree EMI protection, minimising such disturbances. The small size of the device also means it can be mounted in tight spaces, such as the rear of panels, making it ideal for smaller systems.

Working Principle

The DF18C-60DP-0.4V(81) uses a surface mounting technology, with the connector attached to two PCBs with a single metal clip. This allows for a strong mechanical connection, as the clip helps to evenly distribute the stress and strain of mating the boards together. The clip is also adjustable, providing flexibility and accuracy when connecting boards.

The DF18C-60DP-0.4V(81) uses a female-male connection, with each end featuring a different number of contacts. The female connection features up to 60 socket contacts (18 in the 0.4V(81) version) and the male connection dominates with up to 76 contacts. The contacts are not fixed, so they can be added and removed depending on the application needs.

The contacts are connected with an IDC (Insulation Displacement Connection) contact technology, as opposed to a soldering technology. This feature allows for faster and easier assembly, as the contacts are designed to ensure connection with limited solid stress. This reduces the possibility of a weak connection due to human error.

The signal contacts of the DF18C-60DP-0.4V(81) have a total dielectric strength of 500V AC. This helps to prevent electrical interference between the two boards and reduces the risk of electrical damage. The contacts can also handle power and ground applications, ensuring secure and safe interactions between connected boards.

The DF18C-60DP-0.4V(81) is an ideal choice for board-to-board connections, offering high-speed and high-density performance, integration and assembly time savings, and full EMI protection. Its secure connection and adaptability ensure it is suitable for most applications, allowing for reliable performance, accuracy and dependability.

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