DF18E-40DP-0.4V(81) Allicdata Electronics
Allicdata Part #:

DF18E-40DP-0.4V(81)-ND

Manufacturer Part#:

DF18E-40DP-0.4V(81)

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN PLUG 40POS DUAL 0.4MM SMD
More Detail: 40 Position Connector Plug, Outer Shroud Contacts ...
DataSheet: DF18E-40DP-0.4V(81) datasheetDF18E-40DP-0.4V(81) Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: DF18
Packaging: Tape & Reel (TR) 
Part Status: Obsolete
Connector Type: Plug, Outer Shroud Contacts
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: --
Contact Finish: Gold
Contact Finish Thickness: --
Mated Stacking Heights: 1.5mm
Height Above Board: 0.046" (1.16mm)
Description

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

The DF18E-40DP-0.4V(81) is a type of rectangular connector which is an array, edge type, and mezzanine (Board to Board), also known as a BTB, connector. The term ‘mezzanine’ refers to the style or arrangement of sockets in which the pins of one board plug into the contacts of another board. In this case, the DF18E-40DP-0.4V(81) enables connectivity between PCBs on two different levels.

DF18E-40DP-0.4V(81) connectors come in various sizes and shapes. This connector in particular is a miniature array housing, or half-pitch mezzanine. It is 40-pins with 0.4mm pitch, or spacing between pins. It also uses width-to-length-ratio of 2:1, and offers a trade-off between maximum miniaturization and signal integrity.

The DF18E-40DP-0.4V(81) connector provides reliable connections without sacrificing board-to-board spacing. It has an enhanced keying system, which not only helps ensure proper mating, but also allows for different versions for combined applications. It also has improved corner retention, which makes sure the connector is securely attached to the boards.

The DF18E-40DP-0.4V(81) connector provides a number of advantages. First and foremost, it is compact, allowing for reduced board-to-board spacing and maximized miniaturization. This enables the use of smaller printed circuit boards with a greater number of components on them. This can result in a reduced overall size of the device, as well as improved electrical performance and lower production costs.

The DF18E-40DP-0.4V(81) is also highly reliable and has a low resistance ground connection. The pins are plated with gold and tin to improve contact retention. Additionally, the connector features crimp points, which are designed to provide increased contact continuity for higher currents and better wettability.

The working principle of the DF18E-40DP-0.4V(81) is two-fold. First, the two PCBs being connected are mated together by inserting the pins of one board into the contacts of the other board. Then, the crimp points and the gold and tin plated pins provide a secure connection. This connection then safely and reliably transfers signal or power from one board to the other.

The DF18E-40DP-0.4V(81) is found in a wide variety of applications. It is suitable for use in board-to-board connections, as well as for controlling motors, connecting sensors, and providing power and I/O communication in portable and handheld devices. It is also used in medical equipment, industrial control systems, power supplies, and other electronic devices.

In summary, the DF18E-40DP-0.4V(81) is a type of mezzanine, or board-to-board, connector. It is highly compact, with a 2:1 width-to-length ratio and a 0.4mm pitch. It offers enhanced keying and corner retention for maximum reliability and signal integrity. The working principle involves mating the two boards and using the pins and crimp points for a secure connection.

The DF18E-40DP-0.4V(81) is found in a broad range of applications, and is suitable for boards with a greater number of components and improved electrical performance. It is a reliable and efficient connector for controlling motors, connecting sensors, and providing power and I/O communication in various electronic devices.

The specific data is subject to PDF, and the above content is for reference

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