DILB40P-223TLF Allicdata Electronics
Allicdata Part #:

609-4716-ND

Manufacturer Part#:

DILB40P-223TLF

Price: $ 0.42
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN IC DIP SOCKET 40POS TIN
More Detail: N/A
DataSheet: DILB40P-223TLF datasheetDILB40P-223TLF Datasheet/PDF
Quantity: 12507
1 +: $ 0.38430
10 +: $ 0.35784
25 +: $ 0.32180
50 +: $ 0.28602
100 +: $ 0.27418
250 +: $ 0.25031
500 +: $ 0.23839
1000 +: $ 0.19667
2500 +: $ 0.17879
Stock 12507Can Ship Immediately
$ 0.42
Specifications
Termination: Solder
Contact Resistance: 30 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.124" (3.15mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA), Nylon
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: --
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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The DILB40P-223TLF integrated circuit is specifically designed for use as a surface mount socket for a variety of ICs, transistors, diodes, and other semiconductor components. The socket utilizes a spring-loaded pin assembly to hold the component in place, and provide a secure electrical connection from the IC’s pins to the board it is mounted on. The device also helps to prevent physical damage to the component during handling and transport. Additionally, the device ensures a reliable electrical connection between the components and board, which is critical for reliable operation.

The DILB40P-223TLF surface mount socket consists of two plastic sections that house a spring-loaded pin assembly. The back section of the socket is affixed to the board, while the front section is mounted to the component, and the spring-loaded pins make contact with both sections. The socket is designed to provide a reliable electrical connection between the IC and the board, while the springs provide a firm, but not too tight fit to ensure that the component is secure.

The DILB40P-223TLF device is capable of carrying a wide range of high current levels and can be used in a variety of applications including in boards for computers, TVs, radio receivers, amplifiers, and many other electronic products. The socket is designed to accommodate ICs with a lead pitch of 0.4mm, which makes it an ideal solution for many types of applications. In addition, the device is also capable of carrying high frequencies, and thus can be used in RF applications as well.

The working principle of the DILB40P-223TLF socket is relatively simple. When the component is inserted into the socket, the spring-loaded pins compress against the component providing a firm, secure connection. The springs also ensure that the component is firmly held in place, which reduces the risk of it becoming dislodged during handling and transport. The springs also help to reduce the risk of false contacts and poor electronic connections, resulting in a reliable connection between the IC and board.

The DILB40P-223TLF socket is a reliable and cost-effective solution for a wide range of applications. The device is specifically designed to provide a secure electrical connection between ICs, transistors, diodes, and other components, and the boards they are mounted on. The socket utilizes a spring-loaded pin assembly to hold the component in place, and provide a secure electrical connection, and also helps to minimize physical damage to the component during handling and transport. Furthermore, the device is capable of carrying a wide range of high currents, and can be used in a multitude of applications.

The specific data is subject to PDF, and the above content is for reference

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