DILB8P-223TLF Allicdata Electronics
Allicdata Part #:

609-4717-ND

Manufacturer Part#:

DILB8P-223TLF

Price: $ 0.14
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN IC DIP SOCKET 8POS TIN
More Detail: N/A
DataSheet: DILB8P-223TLF datasheetDILB8P-223TLF Datasheet/PDF
Quantity: 16462
1 +: $ 0.12600
10 +: $ 0.11655
25 +: $ 0.08669
50 +: $ 0.07434
100 +: $ 0.07182
250 +: $ 0.06189
500 +: $ 0.05942
1000 +: $ 0.05199
2500 +: $ 0.04704
Stock 16462Can Ship Immediately
$ 0.14
Specifications
Termination: Solder
Contact Resistance: 30 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.124" (3.15mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA), Nylon
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: --
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A DILB8P-223TLF socket is an integrated socket module which contains a unique set of contacts designed to mount ICs, such as DIPs, TQFPs, PLCCs, or QFPs. Many of the socket modules available on the market are compatible with a variety of IC packages and can be used to build up custom socket systems for many applications. However, the DILB8P-223TLF socket stands out from the crowd due to its superior features and focused design.

The DILB8P-223TLF socket is specifically designed for the 223-pin TQFP package, which has traditionally been difficult to accommodate in a conventional package. This socket features a unique 0.4mm pitch arrangement, where the pins are divided into 8 rows, with each row featuring 27 pins. This requires the use of an innovative “twisted” contact design, where the contact pads in each row are arranged in an alternating fashion. This allows for a much tighter spacing between the pins, which gives the socket a small footprint and allows it to securely fit in area-constrained designs.

The socket itself is made from a high-temperature thermoplastic material which is both impact and chemically resistant. This provides excellent durability and reliability in the long-term, and allows for the use of the socket in a wide range of applications. The contacts are pre-fitted in the socket and are held in place by a polyethylene cover which prevents them from falling out during insertion.

The DILB8P-223TLF socket is designed to provide a secure mechanical connection for ICs to be mounted in a design. This also provides electrical contact between the IC and the circuit board, which is essential for the proper functioning of the device. The socket eliminates any need for soldering and makes system assembly much simpler and faster. Also, due to its high thermal conductivity, the socket also helps to maintain the temperature of the IC within acceptable levels, thus preventing any overheating-related problems. This makes the DILB8P-223TLF socket ideal for engineering projects which require fast and reliable mounting of IC packages.

In conclusion, the DILB8P-223TLF socket is a highly reliable and effective solution for mounting 223-pin TQFP packages in a PCB assembly. Its superior features and focused design makes it the ideal choice for any engineer who needs a reliable socket module for their application.

The specific data is subject to PDF, and the above content is for reference

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