DK0060T

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of electronics is a difficult challenge due to their increased heat dissipation. Heat sinks are used to dissipate heat away from the sensitive components and ensure system operation at safe temperature levels. The DK0060T is a special type of heat sink designed to improve heat dissipation. It is constructed from extruded aluminium and features a combination of fins, plates and pins to enable maximum thermal conduction away from the component. This heat sink can be used in a variety of applications, including: power cables, industrial automation systems, computer motherboards, and more.

The DK0060T heat sink works on the principle of leveraging thermal energy conduction to dissipate heat away from the component. The aluminium extrusion profile is designed to provide improved airflow to the component, while the fin design of the heat sink increases thermal conduction from the component to the air. The heat is dissipated away from the component by air convection, which is further boosted by the pin design that maximizes thermal contact area. The heat sink also features an optimised surface design which further improves airflow to maximise convection. Finally, the efficient shape of the heat sink ensures that there is minimal disruption to the thermal flow from the component.

The DK0060T heat sink is ideal for a variety of applications, due to its improved thermal transfer capabilities and efficient shape. It is suitable for use in power cables due to its precise shape and ability to dissipate heat quickly, and for use in industrial automation systems, due to the improved air flow and the reliable performance in elevated temperatures. It can also be used in computer motherboards as it is able to dissipate heat quickly. The DK0060T is also resistant to damage due to its durable aluminium construction.

The high efficiency and reliability of the DK0060T heat sink make it an ideal choice for a variety of thermal management applications. Its combination of plates, fins, and pins ensure maximum heat dissipation, while its optimised shape ensures that there is minimal disruption to airflow. The heat sink’s efficient air flow and reliable performance in elevated temperatures also make it an ideal choice for industrial automation systems. Finally, its robust construction makes it suitable for use in power cables and computer motherboards.

The specific data is subject to PDF, and the above content is for reference