ERM5-020-05.0-S-DV-WT-K-TR Allicdata Electronics
Allicdata Part #:

ERM5-020-05.0-S-DV-WT-K-TR-ND

Manufacturer Part#:

ERM5-020-05.0-S-DV-WT-K-TR

Price: $ 3.12
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .5MM EDGE RATE TERMINAL ASSEMBLY
More Detail: 40 Position Connector Header, Outer Shroud Contact...
DataSheet: ERM5-020-05.0-S-DV-WT-K-TR datasheetERM5-020-05.0-S-DV-WT-K-TR Datasheet/PDF
Quantity: 1000
125 +: $ 2.84256
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: Edge Rate™ ERM5
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header, Outer Shroud Contacts
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Board Guide, Pick and Place, Solder Retention
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 12mm
Height Above Board: 0.309" (7.85mm)
Description

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The ERM5-020-05.0-S-DV-WT-K-TR is a type of rectangular connector, the Arrays, Edge Type, Mezzanine (Board to Board) category. It is designed for applications that require a higher density of connections between two printed circuit boards.

The connector is typically used in applications such as communications, factory automation and industrial robotics. It is compatible with a wide range of different substrates used in printed circuit boards. It is popular for its excellent signal integrity in a wide range of applications.

The connector is formed of a solid pin and a receptacle, which are mated together to form an electrical connection without the need for wires or other components. This helps reduce the size of the assembly and consequently saves space. The pin and receptacle have an internal design which ensures that the cost-of-ownership is minimized and reliability is maximized.

The connector features two different pin and receptacle bodies which enable the assembly to be easily mounted in a variety of different configurations. These include self-mating, board-to-board application and embedded application. The board-to-board application is designed to make secure electrical connections between two printed circuit boards which are connected together. The embedded application involves connecting two printed circuit boards with each other in a perpendicular direction and allows greater flexibility for the design.

The connector is available in a variety of different packages, including but not limited to DIP, QDIP, and SOIC. It is also available in different materials such as polyamide, aluminium, and stainless steel. These materials make it suitable for a wide range of applications, including automotive, communication, industrial, medical, and instrumentation.

The connector offers excellent signal integrity, which ensures that it has a high-performance in a variety of applications. It also has a low profile design, making it ideal for applications that require minimal space. Its small size and low profile also helps reduce the cost of the assembly.

The connector has excellent resistance to moisture, temperature, shock, and vibration. This ensures that it is robust enough to remain operational in a wide range of conditions. The connector also has excellent EMI/RFI shielding, which helps prevent interference. It also has a dust-proof feature, which helps prevent damage to the internal components.

The connector has an improved contact system which uses a form-in-place technology to reduce complex assembly steps and increase the connection cycle life. This provides improved electrical performance as well as a high degree of reliability and durability in voltage and current. The contact system also allows for the connector to be used in applications with higher current and voltage levels.

The ERM5-020-05.0-S-DV-WT-K-TR is an ideal connector for a variety of applications requiring a higher density of connections between two printed circuit boards. It offers excellent signal integrity, resistance to moisture, temperature, shock, and vibration, while also providing a low profile design, improved contact system, and excellent EMI/RFI shielding. Its small size and low profile also helps reduce the cost of the assembly, making it an ideal choice for applications that require minimal space.

The specific data is subject to PDF, and the above content is for reference

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