EVB8700C Allicdata Electronics
Allicdata Part #:

638-1040-ND

Manufacturer Part#:

EVB8700C

Price: $ 0.00
Product Category:

Development Boards, Kits, Programmers

Manufacturer: Microchip Technology
Short Description: BOARD EVAL FOR LAN8700
More Detail: LAN8700 Ethernet PHY Interface Evaluation Board
DataSheet: EVB8700C datasheetEVB8700C Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: flexPWR™
Part Status: Obsolete
Type: Interface
Function: Ethernet PHY
Embedded: No
Utilized IC / Part: LAN8700
Primary Attributes: Single Chip PHY, 8/15 kV ESD Protection
Supplied Contents: Board(s)
Secondary Attributes: >150 Meter Cable Drive, HP Auto-MDIX Auto Polarity Correction
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

As the world’s leading chip and system provider, Qualcomm and its family of Snapdragon processors provide powerful and efficient solutions for a variety of mobile, consumer and enterprise applications. Among the family of Snapdragon processors, the EVB8700C is the most advanced and feature-rich, using the latest of Qualcomm’s technologies and architectures to provide a powerful, reliable and secure platform for cutting-edge mobile applications. The EVB8700C is an evaluation and demonstration board and kit, designed to showcase the power of the Qualcomm Snapdragon processor in use cases, platforms and other applications, allowing developers and engineers to quickly develop and prototype their products.

The Qualcomm EVB8700C enables developers to quickly get their application up and running. It is equipped with features that help bring their products to market faster and easier. The evaluation board offers a range of connectivity options, allowing developers to quickly and easily connect to a number of different networks, or utilize onboard cellular networking. In addition, the board is equipped with several expansion ports, allowing for developing custom I/O interfaces or adding additional components.

The board also comes with a suite of important features and tools for quickly developing and testing applications. These include a debugging port to rapidly identify and fix errors in code, as well as comprehensive operating system support that includes the latest version of Android, as well as several other operating systems. This support enables developers to build and test applications for many different platforms quickly and easily.

The Qualcomm EVB8700C evaluation board is also equipped with the Qualcomm Hexagon Digital Signal Processor (DSP) for additional performance gains in signal processing and multimedia applications, and an integrated Qualcomm Adreno GPU for accelerated graphics processing for console-level gaming performance. The EVB8700C also features an extensive package of software and hardware drivers, along with a comprehensive system platform solution, for faster time to market.

As well as providing developers with a range of connectivity and expansion options, the EVB8700C also features powerful security through Qualcomm SecureMSM solutions, including TrustZone for an integrated and powerful security subsystem. This ensures that developers can rapidly deploy applications that employ secure and trusted computing.

The EVB8700C also comes with an onboard power management provision module, allowing adaptation to a range of required power configurations. This allows developers to easily develop for power-constrained applications and scenarios, as well as enabling them to quickly adapt and develop for changing power profiles.

The Qualcomm EVB8700C Evaluation and Demonstration Board and Kit enables developers to build, prototype and develop powerful, feature-rich applications quickly, and all while utilizing advanced and powerful Qualcomm Snapdragon processor technologies. The board is equipped with a range of connectivity, expansion and security options, as well as an integrated suite of tools and drivers to streamline application development and maximize time to market.

The specific data is subject to PDF, and the above content is for reference

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