FHP27-27-20/T710/M

Series:	FHP
Part Status:	Active
Type:	Board Level
Package Cooled:	--
Attachment Method:	Clip, Tape
Shape:	Square, Fins
Length:	1.063" (27.00mm)
Width:	1.063" (27.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	3.35°C/W
Material:	--
Material Finish:	--

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Thermal - Heat SinksFHP27-27-20/T710/M are heat sinks used to dissipate heat from electrical and electronic components such as microprocessors, integrated circuits, and voltage regulators. The FHP27-27-20/T710/M are designed to increase heat transfer from the heat source to the surrounding air.These heat sinks consist of multiple aluminum alloy plates that form a series of fins along one side of each plate. The fins are typically of the same thickness and shape, and create an array of protruding fins, allowing air to pass more easily over them and around them, leading to increased cooling. The thermal resistance of the fin array is (FHP27-27-20/T710/M) typically quite low - less than 0.2°C/W, which allows excellent heat transfer from the component to the surrounding air.Heat sinks of this general type can be widely used in many applications where waste heat generated by the component must be removed for efficient operation. For example, they can be used in automotive applications to cool engines, transmissions, and other powertrain components. They can also be used in computer systems, telecommunications equipment, and consumer electronic devices. Additionally, they can be used in industrial equipment such as motors, pumps, turbines and other machinery that generate a lot of waste heat.The FHP27-27-20/T710/M heat sinks operate on the principle of convection, which is the transfer of thermal energy from one place to another by the circulation of air or other gas, in this case surrounding the heat source. As the air around the heat source is warmed, it rises. This displacement of warm air creates a low pressure area that sucks in cooler air from the outside, which is heated by the heat source and also rises. This air is then replaced by new cooler air, forming a continuous convection cycle. The fins of the heat sink are designed to maximize this air circulation so that the heat generated by the component is quickly transferred into the surrounding air.In addition to using the FHP27-27-20/T710/M for passive cooling, they can also be used in conjunction with active cooling strategies such as fans, liquid cooling, or heat pipes. Implementing such strategies increases the heat dissipation potential of the heat sink even further. As heat is generated by the component, more power can be produced by having the heat sink disperse it more quickly.The FHP27-27-20/T710/M heat sinks offer a reliable and cost-effective solution for improving the thermal performance of electrical and electronic components. Their low thermal resistance makes them ideal for medium to high power applications. In the automotive industry in particular, they are an excellent choice for components such as engines, transmissions, and computers as they provide an efficient, reliable means of dissipating heat.

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