FX18-60P-0.8SV

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The FX18-60P-0.8SV is a mezzanine, edge type, rectangular array connector. It is primarily used as a board-to-board connector, and its associated products. The main applications of this type of connector are among digital systems, telecommunications, consumer appliances, and computer networks.

The FX18-60P-0.8SV features a total of 60 terminal contacts with a terminal pitch of 0.8 mm. It is designed to meet requirements for high-speed data transfer and can accept a range of wire sizes (AWG#30˜AWG#26). It is designed to be highly reliable with an insulation resistance rating of at least 1000MΩ (min).

The FX18-60P-0.8SV features an extremely small mounting pitch which is designed to meet the requirements of applications that demand space savings. This connector’s low profile allows it to be installed in devices where space is limited. The operating temperature range is between -40°C and +85°C, and it is rated for up to a current of 0.5 A. It is fully compliant to the RoHs standards.

The connector is designed to operate on two levels – the outer array and the inner pin system. The outer array consists of a non-detachable, 60-position, single row arrangement designed primarily to ensure proper insertion. The inner pin system is composed of two rows of 30 terminals connected in parallel, providing a system of 1 x 30 Pin Connector System. The two rows of terminals are tailored to reliable and robust connections between boards.

When it comes to the working principle of the FX18-60P-0.8SV connector, the outer array of terminal contacts is designed to provide a simple engagement interface that requires minimum force to attach or detach the connector. The inner pin system ensures that the board-to-board connection is robust and secure, so that energy and signals can be transferred between the two boards. The insulation resistance of at least 1000MΩ (min) provides further protection against accidental shorts and helps prevent potential damage.

In conclusion, the FX18-60P-0.8SV is a Edge Type, Mezzanine (Board to Board), Rectangular Array Connector. It is designed for high-speed data transfer applications and will ensure reliable electronic connections between boards. The low-profile design of this connector makes it suitable for applications where space is limited, making it an ideal choice for any digital system, communication device, consumer appliance, or computer network.  

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