FX8C-100/100P11-SV6J(71) Allicdata Electronics
Allicdata Part #:

FX8C-100/100P11-SV6J(71)-ND

Manufacturer Part#:

FX8C-100/100P11-SV6J(71)

Price: $ 6.28
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN HDR 200CONT .6MM (2PCS)
More Detail: 200 Position Connector Header, Outer Shroud Contac...
DataSheet: FX8C-100/100P11-SV6J(71) datasheetFX8C-100/100P11-SV6J(71) Datasheet/PDF
Quantity: 1000
1 +: $ 5.70780
Stock 1000Can Ship Immediately
$ 6.28
Specifications
Series: FunctionMax™ FX8C
Packaging: Tray 
Part Status: Active
Connector Type: Header, Outer Shroud Contacts
Number of Positions: 200
Pitch: 0.024" (0.60mm)
Number of Rows: 4
Mounting Type: Surface Mount
Features: Board Guide, Bridged Headers (2)
Contact Finish: Gold
Contact Finish Thickness: --
Mated Stacking Heights: 11mm, 16mm
Height Above Board: 0.368" (9.35mm)
Description

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The FX8C-100/100P11-SV6J(71) is a rectangular connector in the edge type, mezzanine board-to-board array with multiple termination options for power or signal and is suitable for various high-speed applications requiring signal integrity or high-current power connections. This connector is mainly used for applications in which it is important to maintain a secure connection, such as signal integrity, high-speed data transfer, and power transmission. Due to its high number of contacts and small size, it is especially well-suited for applications where high-density and high signal transmission speeds are required in a small space. The FX8C-100/100P11-SV6J(71) rectangular connector is part of a family of connectors used in a variety of applications including backplanes, I/O systems, add-in cards, computer motherboards, and other mezzanine board-to-board applications.

The FX8C-100/100P11-SV6J(71) consists of two parts, the mezzanine board connector and baseboard connector. The mezzanine board connector consists of a plastic shell, a precision contact, terminals, and cover. It has a large contact pitch of 1.25 mm which provides high contact density, and a minimum contact spacing of 0.5 mm, providing a secure and reliable connection. The housings are designed to prevent the ingress of dust and other particulates. The terminals provide a secure connection while allowing for low insertion force. The baseboard connector has a plastic shell with raised posts that provide a secure and reliable connection and guide the mezzanine board connector. The terminals are designed to ensure a solid connection and to minimize the risk of short circuits when the board is inserted.

The FX8C-100/100P11-SV6J(71) connectors are designed to provide reliable and high-performance signal transmission and power connection. The contact design allows for high-speed transmission of data and minimal cross-talk between the signal lines. Additionally, the terminals are designed for low-insertion force and high current-handling capability. The shell of the connector is made of a non-conductive material with a high dielectric constant, making it suitable for high-frequency applications. The connector is also designed to be able to withstand vibration and shock, allowing it to be used in a wide range of applications.

The FX8C-100/100P11-SV6J(71) is a rectangular connector designed for use in a variety of applications requiring signal integrity or high-current power connections. The connector has a large contact pitch of 1.25 mm which provides high contact density, and a minimum contact spacing of 0.5 mm, providing a secure and reliable connection. Its terminals provide a secure connection while allowing for low insertion force. Additionally, the connector is designed for low-insertion force and high current-handling capability, and its shell is designed to prevent the ingress of dust and other particulates. This connector is suitable for applications that require secure, high-speed signal transfer and high-current power connections, such as backplanes, I/O systems, add-in cards, computer motherboards, and other mezzanine board-to-board applications.

The specific data is subject to PDF, and the above content is for reference

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