FX8C-140P-SV(21)

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The FX8C-140P-SV(21) rectangular connector from Molex is part of the company’s Arrays, Edge Type, Mezzanine (Board to Board) series. It is designed for high-speed data and power connections in space-constrained applications, especially those that require high-density connection and/or stackability. With a 0.8mm-pitch connector system, the FX8C-140P-SV(21) consists of a mated header/receptacle package in a right-angle configuration.

The mated package consists of a single row of 21 gold-plated copper alloy pins and a double row of 21 gold-plated metal posts. The substrate is an FR-4 based material and is suitable for lead-free solder joints. The pin and post contacts are wear-resistant and have a maximum operating temperature of 125°C. The mated package is also RoHS2 compliant.

The FX8C-140P-SV(21) is ideal for use in applications such as riser cards, hard disk drives, host board controllers and other space-constrained applications where high-density connection and/or stackability is required. The connector is capable of withstanding over 5,000 mating cycles and is well suited for applications where frequent mate/unmate cycles occur.

The FX8C-140P-SV(21) has a fairly straightforward working principle. It is constructed with a single row of 21 gold-plated copper alloy pins connected to a double row of 21 gold-plated metal posts. The header is then mounted on a printed circuit board and the mating receptacle is placed on top of the header with a ¼ turn-lock. When the two components are mated, the pins are securely held in place by the posts, completing the connection.

The FX8C-140P-SV(21) is a reliable and robust connector, well suited for use in applications where high-density, robust, and reliable connections are required. With its 0.8mm-pitch mezzanine connector system, mated header/receptacle package, and RoHS2 compliance, the FX8C-140P-SV(21) is an ideal connector for use in a variety of space-constrained applications.

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