GC123506BH-8DA.05.N.B515.GN

Series:	MagLev® GC
Part Status:	Obsolete
Type:	Board Level
Package Cooled:	--
Attachment Method:	Bolt On
Shape:	Square, Fins
Length:	1.504" (38.20mm)
Width:	1.504" (38.20mm)
Diameter:	--
Height Off Base (Height of Fin):	0.535" (13.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	2.29°C/W
Material:	Aluminum, Plastic
Material Finish:	--

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Introduction

Thermal-Heat Sinks are used to dissipate thermal energy, usually generated by electronic components within a device, in order to improve device performance and prevent system failures due to overheating. One particular example of a Thermal-Heat Sink is the GC123506BH-8DA.05.N.B515.GN, which is designed to effectively manage thermal energy generated by its electronic components and is of particular use in many industrial and consumer applications.

Applications

The GC123506BH-8DA.05.N.B515.GN Thermal-Heat Sink can be found in many industrial and consumer applications where it is used to improve electronic component performance and enhance system reliability. Some of these applications include:

• Computer Processing Units (CPUs) where the thermal-heat sink is used to cool processors and reduce thermal energy produced;
• USB ports, where the thermal-heat sink is used to divert heat away from the chip as it draws power;
• Laser diode modules, where the thermal-heat sink is used to reduce thermal energy produced by the laser-emitting diode;
• DC motors, where the thermal-heat sink is used to decrease the thermal energy generated during high-speed operation; and
• Electronic discrete components, where the thermal-heat sink is used to improve component performance, reliability, and longevity.

Design and Construction

The GC123506BH-8DA.05.N.B515.GN Thermal-Heat Sink is specifically designed to dissipate large amounts of thermal energy while occupying a minimal amount of space. To achieve this, the heat sink consists of various components, such as:

• Anodized aluminum body with a black finish, providing lasting corrosion protection and dissipating thermal energy quickly;
• Fins to further increase the rate of thermal energy dissipation;
• Reinforced die-cast aluminum body that maximizes surface area and thermal energy dissipation; and
• Threaded mounting posts that allow for convenient and secure mounting.

The design of the GC123506BH-8DA.05.N.B515.GN thermal-heat sink is heavily reliant on the materials used in its construction and their respective thermal conductivities. The combination of these materials ensures optimum thermal dissipation, allowing the heat sink to remain effective in multiple industrial and consumer applications.

Working Principle

The working principle of a Thermal-Heat Sink is simple; it is designed to transfer thermal energy from an electronic component to the environment, thus cooling the component and preventing system failures due to overheating. The GC123506BH-8DA.05.N.B515.GN Thermal-Heat Sink relies on the combination of its components and materials to effectively transfer thermal energy to the environment. The combination of its components and their respective thermal conductivity allows for rapid and efficient heat transfer. The anodized aluminum body increases surface area, thus increasing heat transfer capabilities, while the fins further increase the surface area. These components, in combination with the reinforced die-cast aluminum body and threaded mounting posts, provide maximum heat dissipation in minimal space.

Conclusion

The GC123506BH-8DA.05.N.B515.GN Thermal-Heat Sink is specifically designed for many industrial and consumer applications where it is used to dissipate thermal energy generated by various electronic components. Its components and materials are specifically selected to ensure maximum thermal dissipation in minimal space. This allows the heat sink to effectively manage the thermal energy produced by its components, improving their performance and increasing reliability while preventing system failures due to overheating.

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