HF20G Allicdata Electronics
Allicdata Part #:

HF20G-ND

Manufacturer Part#:

HF20G

Price: $ 2.09
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 TAB/CLIP-ON
More Detail: Heat Sink TO-220 Aluminum 1.0W @ 20°C Board Level,...
DataSheet: HF20G datasheetHF20G Datasheet/PDF
Quantity: 347
1 +: $ 1.89630
10 +: $ 1.84527
25 +: $ 1.79525
50 +: $ 1.69546
100 +: $ 1.59566
250 +: $ 1.49595
500 +: $ 1.44607
1000 +: $ 1.29648
Stock 347Can Ship Immediately
$ 2.09
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Shape: Rectangular, Fins
Length: 0.790" (20.07mm)
Width: 1.102" (28.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.787" (19.99mm)
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 13.10°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

HF20G application field and working principle

The HF20G is a thermal management solution that is designed for large-scale applications within the electronics industry. It is often used in power supplies and in other areas that involve large amounts of heat. The HF20G is designed to provide a superior cooling solution that is both efficient and cost effective. The benefits of the HF20G are many, and it is ideal for applications that require high levels of reliability and performance.

The major advantage of the HF20G is its thermal efficiency. This is achieved through two key design elements. The first is the use of an open-frame design, which allows heat to escape quickly and easily. The second element is the use of side-minimized fins, which allow for better heat transfer. These two elements work together to ensure that the system is able to dissipate heat quickly and efficiently.

The open-frame design of the HF20G makes it easier to install since no additional hardware is required. It also ensures a high level of reliability and performance as the system is capable of dissipating heat faster and more efficiently. The side-minimized fins also help to maximize the efficiency of the system by ensuring that it is capable of quickly cooling any area of the system that is exposed to high temperatures.

In addition to its efficient cooling capabilities, the HF20G is also designed to be compact and lightweight. This makes it easy to transport, allowing it to be used in a variety of applications. The system is also designed to be easy to install, and its low weight make it ideal for mobile applications where space is at a premium.

The HF20G is also designed to eliminate the need for copper wires which can be expensive and difficult to install. Instead, the system utilizes a flat-plane design which allows for direct support of components, making it ideal for applications where space is at a premium. This also reduces the amount of wiring required in the system, as well as the potential for interference with other components.

The HF20G is a versatile solution that provides a superior level of thermal management. It is capable of dissipating large amounts of heat quickly and efficiently, and its lightweight design makes it ideal for applications where space is at a premium. It is also designed to eliminate the need for copper wiring, making it an extremely cost-effective solution for large-scale thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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