HIF2E-GP

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High speed fine wire-grid panel (HIF2E-GP) connectors have been designed to meet the high-speed and high signal density requirements of today’s electronic systems. These connectors offer excellent performance and are used in a variety of applications, including communications, consumer electronics, medical, military, and even aerospace.

The HIF2E-GP connector is characterized by a rectangular or square design that consists of rows of fine, evenly spaced, and uniformly sized signal contacts which are arranged horizontally and vertically in 5, 7, 9, 11, 13, and 19 rows. The signal contacts are made from gold-plated beryllium copper and provide excellent electrical and mechanical performance.

The connector\'s design allows it to fit into much tighter spaces than other signal connectors, thus making it a superior choice for applications that require high-speed signal density. In addition, the design provides superior signal-to-noise ratio, making the connector an ideal choice for critical signal applications.

The main application field of HIF2E-GP connector is high-speed signal transmission. This includes Gigabit Ethernet, Fibre Channel, and optical displays. The connector can also be used in mobile and automotive applications such as Bluetooth, cellular telecommunication, and high-definition video. Besides the above-mentioned applications, the connector is also suitable for embedded systems, Wi-Fi, WiGig, and near field communication solutions.

The working principle of HIF2E-GP connector is based on magnetic principle. It uses a pair of pins as contacts to form a signal link. The two pins are then placed in a plastic housing that is filled with two magnetic substances. When a signal is sent through the connector, the two magnetic substances create a permanent magnetic field that produces an electric current. This electric current then creates a strong signal that is then sent to the receiving end.

The connector provides superior performance due to the quality of the design. It offers excellent impedance matching, signal integrity, and crosstalk performance. The connector also provides better thermal dissipation than other signal connectors, making it suitable for high-power applications. Finally, it has superior electromagnetic shielding quality, making it ideal for applications that require high shielding performance.

HIF2E-GP connectors are becoming increasingly popular for high-speed signal applications due to their superior performance. They offer excellent signal-to-noise ratio, thermal dissipation, and electromagnetic shielding qualities. They are ideal for applications that require high-speed signal density and are suitable for embedded systems, telecom, and automotive applications.

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