HIF7C-80PA-1.27DSAL(71)

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The HIF7C-80PA-1.27DSAL(71) one of the rectangular connectors – arrays, edge type, mezzanine (board to board), is designed for a variety of high reliability applications. This type of mezzanine connector has been designed and manufactured to provide superior performance, reliability, and cost effectiveness. It features a wide range of compliance and quality assurance including UL, CSA, and IEC certification. It is designed and tested in accordance with MIL-DTL-1766 and MIL-DTL-1766A.

The HIF7C-80PA-1.27DSAL(71) offers a versatile and reliable solution for a variety of applications. It features a robust design with a wide operating temperature range from -55 ºC to +125ºC. The contact material is copper alloy with gold plating on the mating surfaces. It also features a high retention force and secure mating snap technology which ensures a secure connection. It has a unique combination of Push-Pull, Stack, and Flip/Rotate options, allowing for the mating of multiple connectors into a single configuration. The connector is also designed for high-speed data and power transfer and has a high signal integrity, providing reliable performance for a wide range of applications.

The HIF7C-80PA-1.27DSAL(71) is designed for applications that require high reliability and robust performance. Its blind mating feature eliminates the need for costly mating hardware while providing for a secure connection. Its low profile design reduces waste and cost by decreasing the package size. It is also suitable for high-speed data and power transfer due to its high signal integrity. The overall design also provides superior shock, vibration, and noise immunity.

The working principle of the HIF7C-80PA-1.27DSAL(71) involves the use of a mezzanine architecture which provides a secure connection between two boards. The connector consists of two main body parts, the plug and the socket, each of which contain their own sets of contact pins. These contact pins are arranged in a specific configuration to ensure an efficient connection between the two boards when connected. When the connector is plugged in, the pins of the plug and socket are in contact with one another, creating an electrical connection. The contact pins are designed to provide a high level of resistance against short circuits and other electrical disturbances. The mezzanine architecture also provides a low profile connection, reducing the space required for the connection.

The HIF7C-80PA-1.27DSAL(71) provides a reliable and robust solution for applications that require a secure connection. Its wide range of compliance and quality assurance, its robust design, and its high signal integrity make it an ideal choice for a variety of applications. Its blind mating feature eliminates the need for costly mating hardware while providing for a secure connection. Its low profile design reduces waste and cost by decreasing the package size. The overall design also provides superior shock, vibration, and noise immunity.

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