HIF7CA-60PA-1.27DSA(71)

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The HIF7CA-60PA-1.27DSA(71) is a form of edge type, mezzanine (board-to-board) rectangular connector array. Specifically, it is an array designed for high-speed signal transfer and reliable electrical connections with thermal and thermomagnetic protection for high-density circuitry. It is made with high temperature plastic and a stamped metal strain relief under the contact body, which improves electrical performance and makes it compliant with higher temperature operating profiles.

The device is designed for use in applications such as industrial and automotive systems, high-speed processing and communication signals, and any system that is sensitive to interference and requires reliable signal integrity. The rectangular array is designed to accept two rows of through-hole board-to-board connections, with additional row of surface mount pins for power and ground connections. This allows for a sturdy design, and makes the connector well suited for applications with high current loads.

The HIF7CA-60PA-1.27DSA(71) features six contacts per row. It supports a consistent signal transfer up to 6.0GHz, allowing it to be used in a wide range of applications. It also has a pick-and-place-friendly design that facilitates automatic assembly. The connector is designed with HDI (High Density Interconnect) technology, which enables the device to maintain its electrical performance even in high-frequency applications.

The HIF7CA-60PA-1.27DSA(71) is designed with a unique patent-pending dual-port mating structure, which combines two signal ports and a ground port. This feature not only improves signal integrity, but also increases board density by reducing the need for extra large board areas. The device is also solderdip rated at the highest level for full protection in the most extreme environments. The mating pairs are designed to self-align in the correct position for a secure connection.

The main working principle of HIF7CA-60PA-1.27DSA(71) is the signal flow between two ports: the first port sends a signal out from the source board, and the second port receives this signal and sends it to the destination board. The signal is transferred in both directions between the two ports with a high-frequency signal. This is done by using a combination of physical contact between the mating ports and shielding to protect the signal from interference. The device also helps in preventing electrical noise from entering the system, by reducing the connection gap between the two ports.

The HIF7CA-60PA-1.27DSA(71) is an ideal solution for applications that require consistent, reliable signal transfer up to 6.0GHz. It provides excellent electrical connections with thermal and thermomagnetic protection and is well suited for high-density circuitry. Its high HDI profile makes it ideal for custom systems, as it allows for a very high degree of board density. The connector is also highly shock resistant and features a pick-and-place-friendly design for easy installation and maintenance in production environments.

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