HIN241CBZ-T

The HIN241CBZ-T is an interface component, consisting of a driver, receiver, and transceiver, that is used to facilitate the transfer of digital data between components in an electronic system. The component is manufactured by Intersil Corporation and is part of their “HIN” series of standard-logic interface components.

The HIN241CBZ-T is a low-voltage, high-speed CMOS logic component, which makes it suitable for integration into a variety of applications, from industrial, to consumer, to automotive applications. The component is capable of transmitting and receiving data at 15Mbits/sec, and features an on-chip ESD protection circuit that meets the 4kV Human Body Model requirements. The component also features a standby current of 1uA, making it an power-efficient option for implementing high-speed digital data transfer.

The component comprises a driver, receiver, and transceiver. The drivers transfer data from one circuit element to another, while the receiver converts the incoming data from voltage levels to logic levels and transmits the data to the receiver. The transceiver, consists of both a receiver and driver, which communicates with other transceivers and is driven by the on-chip control logic.

The HIN241CBZ-T is designed to operate on a single +3.3V power supply, and has a variety of input/output packaging options, including a space-saving TSSOP-8 package, which allows it to be used in small form factor applications. The component also features an integrated on-chip frequency divider, which allows the component to be operated at different frequencies, depending on the specific application.

The HIN241CBZ-T interface component is a versatile and reliable choice for implementing high-speed digital data transfer in a variety of applications. Its low-voltage, high-speed CMOS logic technology, integrated on-chip ESD protection circuit, and low standby current make the component an efficient option for enabling digital data transfer in various applications. Furthermore, the component’s variety of input/output packaging options make it a cost-effective option for use in a variety of applications.