HM13220LF

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• HM13220LF Application Field and Working Principle
• Introduction

HM13220LF is a backplane connector housing system from Molex. It features:

• High density
• 6 column / row combiations
• 192 positions per row
• Low profile for maximum board space
• Low contact force for improved insertion / extraction
• Easily extractable headers

The HM13220LF housing system provides a wide range of application possibilities for a variety of high, medium, and low speed product applications. The system was developed in parallel with I/O, Modem, PICMG, ESDI and SCSI applications in mind in addition to other high speed computing applications.

• Application Field

The HM13220LF housing system offers various applications, from high speed computing to I/O, Modem, PICMG, ESDI and SCSI applications. It is mainly used in communications, industrial control and PC/motherboard applications. It can also be used in a variety of audio-video applications within the consumer electronics field.

The connector makes an excellent power fan out solution for systems utilizing high power CPUs. It also provides options for hot swappable applications where fan-in or fan-out is required. Additionally, its low contact force makes it an ideal choice for applications requiring improved contact insertion.

• Working Principle

The principle behind the HM13220LF housing system is simple and effective. It is an easy to use system with two connectors, a header and a wall plate-like receptacle. The header has 192 pins that are all independently extractable with a simple tool. The receptacle on the other hand has two rows of contact fingers that connect to the pins in the header to form a complete electrical connection.

The contact force of the pins and the receptacle contact fingers provides a secure electrical connection. High levels of contact force are generated when the header pins are inserted into the contact fingers. This provides a reliable electrical connection under vibration and high temperature conditions.

• Conclusion

The HM13220LF housing system is an excellent choice for a variety of high, medium, and low speed product applications. With its high density, low profile, and low contact force design, it provides reliable electrical connections under vibration and high temperature conditions.

Its 6 column / row combination with 192 pins per row make it a great choice for applications requiring fan-in or fan-out solutions. Additionally, its easy to extract header pins make it an ideal choice for applications where hot-swapping is required.

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