HM2C01D0C010N9LF Allicdata Electronics
Allicdata Part #:

HM2C01D0C010N9LF-ND

Manufacturer Part#:

HM2C01D0C010N9LF

Price: $ 4.76
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN RECEPT 20POS TYPE LF
More Detail: 20 Position Receptacle, Female Sockets Connector 0...
DataSheet: HM2C01D0C010N9LF datasheetHM2C01D0C010N9LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
5040 +: $ 4.32776
Stock 1000Can Ship Immediately
$ 4.76
Specifications
Series: Millipacs®
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Receptacle, Female Sockets
Connector Style: LF 4
Number of Positions: 20
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Free Hanging (In-Line)
Termination: IDC
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 250V
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are multi-contact connectors that are responsible for the electrical connection between different circuit boards and substrates. Hard metric connectors are a family of backplane connectors used in a variety of electronic applications. The HM2C01D0C010N9LF backplane connector is a standard hard metric connector that meets certain requirements to be used in high-density applications.

The HM2C01D0C010N9LF backplane connector is designed to be used in high-density applications. It uses a two-row pins design that allows for up to 1,600 I/O positions in a high-dense placement, with only a 2mm pitch. The connector is designed to be used in both single-ended and differential type signal transmission, providing an environment that is suitable for the most demanding applications. The connector features a low profile and a robust design that provides excellent reliability and stability.

The hard metric compliant HM2C01D0C010N9LF connector features a board-to-board redirection that allows for front-panel backplane routing, making it suitable for a wide variety of applications. It also features quick disconnect pins which provide an interference-free connection for optimal signal integrity. The connector also features shielded contacts that provide added protection against EMI/RFI and other electrical interference.

The HM2C01D0C010N9LF backplane connector features a Reliability Under Stress (RUS) functionality that enables it to better withstand the environmental stresses encountered in industrial environments. It has a wide operating temperature range of -55°C to + 155°C, making it suitable for applications from industrial automation to telecommunications. The connector is also vibration- and shock-resistant, making it suitable for high-level transportation applications.

The working principle of the HM2C01D0C010N9LF backplane connector is quite simple. It works by transmitting a signal between the connector pins, when the connector is mated. The signal is then redistributed via the internal routing of the connector to the applicable board contacts. The connector also features a secure locking mechanism that ensures a robust connection and reduces the risk of accidental separation.

The HM2C01D0C010N9LF is a versatile connector used in a variety of applications. It is suitable for PCB backplane systems used in communication systems, computers, industrial automation, robotics, automotive, and meterological applications. It is also suitable for a wide range of other applications, including medical, aviation, defense, maritime, and satellite applications.

The HM2C01D0C010N9LF backplane connector is an efficient and reliable connector that meets the requirements of the most demanding industrial applications. It is capable of ensuring high signal integrity and stability at a high-density placement, and is capable of withstanding environmental stress. The connector is easy to install and maintain, making it a great choice for high-density applications.

The specific data is subject to PDF, and the above content is for reference

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