HM2C09P22FCLF Allicdata Electronics
Allicdata Part #:

HM2C09P22FCLF-ND

Manufacturer Part#:

HM2C09P22FCLF

Price: $ 3.73
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPACS COVER
More Detail: Position Connector
DataSheet: HM2C09P22FCLF datasheetHM2C09P22FCLF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
2880 +: $ 3.39140
Stock 1000Can Ship Immediately
$ 3.73
Specifications
Series: --
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: --
Connector Style: --
Number of Positions: --
Number of Positions Loaded: --
Pitch: --
Number of Rows: --
Mounting Type: --
Termination: --
Connector Usage: --
Contact Finish: Gold or Gold-Palladium
Contact Finish Thickness: --
Voltage Rating: --
Operating Temperature: --
Features: --
Description

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Backplane Connectors - Hard Metric, Standard - are special types of connectors designed to provide a reliable connection between two backplanes or boards. HM2C09P22FCLF backplane connectors are designed for high densities and can be used in applications where space is at a premium. They are extremely robust and can handle high temperatures and environmental conditions.

HM2C09P22FCLF backplane connectors feature a unique ‘channel’ design with internal open tips and a clip-containment system. The connectors are designed to be crimped onto the board, so no external fixings are required. This makes installation easier and reduces the possibility of incorrect connections. The connectors are additionally protected with a sealed grade-4 plastic sheath, and are waterproof and dustproof.

These backplane connectors are suitable for a wide range of applications, including industrial automation, industrial networks, home automation, electrical power, and many more. Their flexibility, robustness, and waterproof construction make them a viable solution for many types of applications. HM2C09P22FCLF backplane connectors are also available with various customizations, such as polarization, to ensure compatibility with different types of application.

The working principle of HM2C09P22FCLF backplane connectors is relatively simple. The internal open tips are designed to contact the board pads and make electrical connections. The external clip-containment system ensures that the connector remains secure and will not come apart when subjected to physical force or movement. The sealed plastic sheath protects the internal connections and is designed to withstand external forces, such as vibration and extreme temperatures.

The connection between the board and the connector is designed to be reliable and stable, even under extreme conditions. The external housing is designed to evenly distribute force and minimize imperfections in the connection. The connection is designed to stay in place even when faced with external forces, so it can be used in applications that require frequent movement. The unique clip-containment system also ensures that the connection remains secure, even when subjected to superimposed thermal cycles.

HM2C09P22FCLF backplane connectors offer a number of advantages over traditional connectors, such as increased wiring density, improved signal integrity, and a more robust connection. They are also easy to install and require minimal maintenance. The hardened grade-4 plastic sheath is designed to provide a waterproof and dustproof connection, making them suitable for even the most demanding applications.

HM2C09P22FCLF backplane connectors are an ideal solution for industrial and commercial applications. Their water and dust resistance, high temperature resistance, and increased wiring density make them an attractive option. The unique clip-containment system offers excellent protection against mechanical and thermal disturbances, ensuring that the connection remains reliable and stable. With their ease of installation and customizations, these connectors are an excellent choice for a wide variety of applications.

The specific data is subject to PDF, and the above content is for reference

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