HM2H27P1116

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Backplane connectors are the most widely used type of interconnect components used in the electronics industry. The HM2H27P1116 housing is a dedicated housing designed to meet the needs of high-speed, high-density applications where QDR is critical. This housing is designed to offer superior signal integrity, reliability and flexibility that meets the requirements of today’s industrial and military applications.

The HM2H27P1116 housing has a full composite construction and offers complete signal shielding from outside EMI/RFI interference. The housing is designed to enable HDI, CCA, flex, and MCMA capabilities. The backplane has an ultra-miniature form factor which is ideal for high-density applications that require superior signal integrity. The housing features low standoffs and special wave spring contacts with a maximum working voltage of 500V.

The HM2H27P1116 housing supports a range of interfaces including EIDE, SAS, SATA and PCIe. It has a maximum operating temperature of -40°C to +85°C and a maximum contact rating of 3A/50V. The housing is also RoHS compliant and is UL/CSA certified.

The HM2H27P1116 housing is designed to provide superior signal integrity for high-speed data transfer applications. It has high crosstalk immunity and low EMI levels due to its metal shielding. The housing also supports two-point, voltage-mode backplane and accepts up to 12 high-speed differential pairs. The backplane supports multiple protocols and can be configured for point-to-point data link transfer, SDR data link transfer, or can provide a crossbar network for bidirectional data transfer.

The HM2H27P1116 housing is suitable for a wide variety of applications including communications, test and measurement, industrial control, telecommunications, networking, medical devices, aerospace, defense and debugging. It is also used in storage solutions for computer systems. The housing provides high-performance signal integrity, reliable operation and flexible solutions for a wide range of applications.

The working principle of the HM2H27P1116 housing is to provide robust signal integrity and efficient data transfer for a wide variety of applications. It provides an optimal data transfer environment by enabling high-speed, low-power transmission. The housing features a low-profile design and is designed to reduce crosstalk and EMI levels. Its signal shielding ensures compliance with IEEE standards and ensures reliable data transfer. The housing provides a wide variety of connection options such as pin headers, IDC connectors and RJ-45 jack connectors.

The HM2H27P1116 housing is must-have for any high-performance signal integrity application. It offers faster data transfer rates, improved heat dissipation and superior signal integrity in an ultra-small form factor. The housing is highly reliable and can handle high-speed, high-density data traffic. With its superior signal integrity, reliable operation and flexible solutions, it is the perfect choice for a wide variety of applications.

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