HM2H71P1LF

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Backplane connectors are devices designed for communication between multiple electronic components and are used to connect the backplane of a circuit board to other devices. The HM2H71P1LF is a type of backplane connector composed of two-piece modular housings. These modular housings are divided into two types - the primary housing and the secondary housing. The primary housing contains the contacts for connecting the backplane and the secondary housing holds the printed circuit boards.

The HM2H71P1LF is a hybrid connector system designed for backplanes in line cards, power supplies and other system applications. It has a signal/power design which provides power and signals, while the modular design allows easy customization for different backplane configurations. The HM2H71P1LF utilizes a four-point contact system for its interconnect system for improved reliability and reduced contact resistance. This contact system also allows for accurate alignment and low insertion force.

The HM2H71P1LF is constructed with high-quality polyethylene (PE) to withstand temperatures up to 200°C and offers UL 94 V-0 level flammability rating. It also features a polarizing key which allows the connection to be oriented correctly and to ensure proper mating. The HM2H71P1LF can be easily installed in the panel-mounted backplane with the aid of the mounting screws.

The HM2H71P1LF has an extended contact wedge geometry for improved electrical interface stability and more effective signal transmission. The contacts on the HM2H71P1LF are constructed of high-quality tin-plated copper alloy and provide an average insertion force of 0.48N and a maximum insertion force of 1.4N. This combination of features makes the HM2H71P1LF suitable for a wide range of applications including automotive, industrial, and communication systems.

The HM2H71P1LF works on the principle of providing an electrical connection between the backplane and multiple circuit boards. It works by connecting the contact pins of the primary housing to the contact pads on the printed circuit board. The contact pins are then connected to the backplane by means of an interconnect system. This allows data to be transferred between the backplane and the printed circuit board, thus providing a connection for the electronic components of the circuit board.

The primary application of HM2H71P1LF is to provide an electrical interconnect between the backplane and multiple printed circuit boards. It can be used in line cards, power supplies, and other system applications. It is also suitable for use in the automotive and industrial sectors due to its rugged construction and high-temperature rating.

In conclusion, the HM2H71P1LF is a two-piece modular housing designed to provide an electrical interconnect between the backplane and multiple printed circuit boards. Its four-point contact system provides improved reliability, reduced contact resistance, accurate alignment, low insertion force, and extended contact wedge geometry for greater electrical stability. It can be easily installed in the panel-mounted backplane and is suitable for use in automotive, industrial, communication, and other system applications.

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