HM2H27P1196 Connectors, Interconnects

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The HM2H27P1196 is a backplane connector housing manufactured by industry leader Molex. This model offers compatibility with various board-to-board connector systems, making it an asset when designing interconnectivity in complex systems. Furthermore, it is highly reliable, durable and easy to install. In this article, we will look at both the application field of the HM2H27P1196 as well as its working principle.

Application Field

The HM2H27P1196 is a part of the large 120-position range of HDM Backplane Connectors Housings. This product range is intended for use as bridging techniques in high-density applications due to its low profile height and high-density design. Accordingly, it is ideal for applications requiring a dense and space-saving connection.

Specifically, the HM2H27P1196 is best suited for applications in datacoms, computer, telecommunications and medical equipment. This is due to its impressive temperature range that covers from -55°C to +105°C, high current carrying capacity and low insertion loss. This makes the HM2H27P1196 very reliable and suitable for high-reliability applications. Additionally, the versatile design allows the housing to be mated with either straight or right-angle SMT board mount socket and header connectors, as well as horizontal or vertical wire-to-board connectors.

Working Principle

The main body of the HM2H27P1196 is an elastomeric material known as Liquid Crystal Polymer (LCP). This material is thermoplastic in nature and known for its dimensional stability over temperature, low coefficient of thermal expansion, high stiffness and good chemical and flammability properties. This is why LCP is commonly used in the manufacturing of electronics components due to its excellent electrical insulation properties.

The HM2H27P1196 housing typically mates with two SMT board-to-board connector systems such as KK® 687 Series Female Header Connectors. This type of board-to-board connector utilizes an insulation displacement contact (IDC) technique that operates under compression. This IDC technique makes contact through a flat strip of copper wire that is slightly thinner than the hole that it is pushed into. Once the copper strip is pushed in, it makes contact with the conductor on the opposite side due to the compression forces created in the process.

The HM2H27P1196 also features low-self-inductance and cancellation of common-mode noise. This is enabled through a special low-inductance module circuit board design combined with ground shielding. This reduces the amount of leakage ground points in the system, in turn, allowing for improved electrical performance. Additionally, the HM2H27P1196 utilizes integrated windows that maximize signal transmission while mitigating the escape of electromagnetic interference (EMI) and radio-frequency interference (RFI).

Conclusion

In conclusion, the HM2H27P1196 backplane connector housing from Molex is an ideal choice when looking for a reliable and durable board-to-board connector system. The versatile design, advanced features and high temperature range make it ideal for use in a variety of applications such as datacoms, computer, telecommunications and medical equipment. Furthermore, its working principle allows for improved performance as well as the reduction of common-mode noise and EMI. All in all, the HM2H27P1196 is an ideal choice for any board-to-board interconnectivity need.

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